Abstract: An input/output module includes a device communication connector apparatus for connecting at least one conductor between the module and at least one device and interface apparatus for causing the module to place any of a plurality of signals on any of a plurality of contacts of the device communication connector apparatus. The interface apparatus includes at least one electronic integrated circuit providing a selectable interconnection apparatus to a particular one of the contacts. The interface apparatus is configurable by a user of the module. A method of configuring the module includes providing inputs on a personal computer, communicating with a web server embedded in the module, to determine a specific interconnection apparatus for each of the contacts.

Abstract: An input/output module for implementing directions from a controller for sending and receiving signals to and from devices. The input/output module includes a microprocessor for communication with, and receiving programming from the controller. The input/output module further includes device communication connectors, each having number of pins, each pin for interconnection with a cable conductor to a device. The input/output module has an ASIC for each of the pins, providing a controlled interface with the corresponding pin. Each ASIC has interconnection apparatus, selectable by the microprocessor for providing a particular interface with the pin served by the ASIC.

Abstract: An input/output module for implementing directions from a controller for sending and receiving signals to and from devices. The input/output module includes a microprocessor for communication with, and receiving programming from the controller. The input/output module further includes device communication connectors, each having number of pins, each pin for interconnection with a cable conductor to a device. The input/output module has an ASIC for each of the pins, providing a controlled interface with the corresponding pin. Each ASIC has interconnection apparatus, selectable by the microprocessor for providing a particular interface with the pin served by the ASIC.

Abstract: A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. Motion is begun along a straight line segment while accelerating to a first path velocity. During this acceleration, the system computer calculates a series of straight line segments and interconnecting sinusiodally shaped paths over which the wafer is to be guided to the second point. The straight line segments and sinusiodally shaped paths are calculated so as to minimize total path length and the time required to move the wafer from the first point to the second point. The system computes the point of entrance and exit to and from each straight and sinusoidal path.

Abstract: An apparatus for transferring material winding between spools. The apparatus includes spindels for positioning first and second spools in a co-planar arrangement with parallel axes of rotation. With the material initially secured to the base of a first spool with tape, a winding mechanism is energized to turn the spools. When the first spool is filled, a first sheave directs the incoming material to the second spool which is rotated at the rate of material supply. A tape applicator is then directed to apply a section of tape over the material, pressing it against the base of the second spool. A small wire is included on the base of the tape being applied. The applicator force on the wire against the material is designed to be sufficient to sever the material, separating the material on the first spool from the material being wound on the second.

Abstract: A follower apparatus mounted on a track running parallel to an axis of rotation of a spool. The apparatus has a base with a roller mounted thereon and having an axis of rotation parallel to the rotational axis of the spool, the roller providing support and guidance to the material being wound. A pulley is rotatably mounted to receive material from the roller and redirect the direction of material traveled. Light beams and detection apparatus are positioned to detect material excursions to pre-determined off center portions of the roller. The follower positioning apparatus responds to signals detecting the material by repositioning the follower to place the material back on to a center zone of the roller.

Abstract: A system for making interconnections between an input/output module and a first device and a second device wherein the system uses standard cables and connectors. The input/output module includes a standard first connector for making connection with a standard first transmission line cable for conveying signals between the module and the first device, and at least one second connector, with such second connector connecting to a first end of a second standard cable. A second end of the second standard cable includes a standard cable connector for making connection to a corresponding connector of the second device. The input/output module is configured to contain programmable logic for making the required connections between the module and the first and second devices.

Abstract: A wafer handling apparatus having input and output robotic systems directed by a programmed controller. Each system has components including a robot, a twist and rotate, and a carrier and automated carrier rail. The input system is for removing wafers from their wafer pod, placing them in the carrier and transporting them via the rail to a wafer processing area. The output system performs the reverse operation, taking wafers from a carrier following processing and placing them in a pod. Each robot includes a plurality of interconnected, articulated cantilevered arms. The last one of the arms has a wand on one end and a laser emitter detector on the other end, and operates in cooperation with the controller to provide location detection of system components. The controller also includes circuitry for sensing contact of the wand with an object by measuring the increased robot motor torque occurring upon contact.

Abstract: Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door.

Abstract: An alignment device for use with a robot for manipulating and aligning a series of semiconductor wafers with respect to an edge fiducial and the center of each wafer is disclosed. The device includes a rotary vacuum chuck for holding a wafer, and an edge detector comprising a light source that extends across the wafer edge as it moves and creates a shadow that falls on a charge coupled device (CCD) below. Output data from the CCD relative to the wafer edge position is processed by a programmable logic circuit and converted to quadrature data which is fed to the logic section of a controller. The controller is programmed to calculate the location of the wafer fiducial relative to the chuck axis and further to calculate the angular and distance offset of the wafer center from the longitudinal axis of the robot arm so that the robot arm can be moved to center the wafer with its fiducial at a preselected location before the wafer is removed from the rotary chuck.

Abstract: A method and apparatus for automatically calibrating the precise positioning of a wafer handling robot relative to a target structure is disclosed. The apparatus comprises a machine controller connected to robot having an end-effector with three degrees of movement. The controller has a memory with stored rough distance and geometrical data defining the general location of structural features of the target structure. The robot is programmed to move toward the target structure in a series of sequential movements, each movement culminating with the robot end-effector touching a preselected exterior feature of the target structure. Each touching of the end-effector is sensed and provides data for the controller which then calculates the precise location of the target structure. The data accumulated during a series of touching steps by the robot end-effector is utilized by the controller to provide a precise calibrated control program for future operation of the robot.

Abstract: A system for automatically calibrating a semiconductor wafer handling robot so that the robot will move wafers into and out of precise locations within enclosures that form process stations or storage cassettes is disclosed. The system comprises a controller having memory and logic sections connected to a robot having an articulated arm that is movable in vertical (Z), horizontal (.theta.), and radial (R) directions and having a wafer retaining wand at the end of the arm. Dimensional characteristics of the robot wand and the enclosures are stored in the controller memory. Sensors are provided at each enclosure and/or the robot wand which are activated and provide signals to the controller that are relative to the wand position. The robot is programmed to execute a series of progressive movements at each enclosure location which are controlled by a combination of sensor response signals and the appropriate dimensional characteristics.

Abstract: Method and apparatus for measuring the velocity, whether rotary or reciprocating, of a servo shaft driven cyclically by a motor, without employing a tachmometer, while maintaining accuracy despite environmental electrical noise. From movement of the shaft a pair of overlapping square-wave signals in quadrature are produced with transition expressible in Gray Code for each cycle. A clock continuously produces a large number of evenly spaced clock pulses constituting a series of consecutive sample intervals. A signed value representing the algebraic sum of all the quadrature transitions occurring during a sample interval is determined and stored. The number of clock pulses between two quadrature transitions, each transition being the last qualified transition of the two most recent sample intervals having transitions is determined. A computer divides the sample intervals by the number of clock pulses which occurred between the selected quadrature transitions.

Abstract: Method and apparatus for measuring the velocity, whether rotary or reciprocating, of a servo shaft driven by a motor, without employing a tachometer. From the movement of the shaft is produced a pair of signals in quadrature, with transitions expressible in Gray code for one cycle as 00, 01, 11, 10 and then back to 00. Meanwhile, a clock provides a large number of evenly spaced counts per selected quadrature transitions. The number of counts between two selected quadrature transitions is read and the total number of quadrature transitions between the selected transitions is divided by the total number of counts during the same time.