Abstract: A process for producing an electronic component, such as a Hall sensor, in which electronic parts are located in a plastic housing. The process includes the steps of locating the electronic parts in a hot-melt adhesive, allowing the hot-melt adhesive to solidify, and finish-extrusion coating the electronic parts in the solidified hot-melt adhesive to form the housing. In an alternative embodiment, the process may also include the step of embedding the electronic parts in the hot-melt adhesive. In yet another embodiment, the process may also include the step of extrusion-coating the electronic parts with the hot-melt adhesive. Materials having substantially similar coefficients of thermal expansion may be used for the hot-melt adhesive used for mounting the electronic parts, and for the finish-extrusion coating that forms the housing to minimize effects of thermal expansion. The process is efficient and cost effective.