Abstract: The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.