Patents Assigned to Besi Switzerland AG
  • Publication number: 20210195816
    Abstract: The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.
    Type: Application
    Filed: March 9, 2021
    Publication date: June 24, 2021
    Applicant: BESI SWITZERLAND AG
    Inventors: Norbert BILEWICZ, Andreas MAYR, Hugo PRISTAUZ, Hubert SELHOFER
  • Patent number: 10973158
    Abstract: The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: April 6, 2021
    Assignee: BESI SWITZERLAND AG
    Inventors: Norbert Bilewicz, Andreas Mayr, Hugo Pristauz, Hubert Selhofer
  • Patent number: 10629465
    Abstract: The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.
    Type: Grant
    Filed: May 4, 2019
    Date of Patent: April 21, 2020
    Assignee: BESI Switzerland AG
    Inventors: Harald Handlos, Florian Speer, Juergen Stuerner
  • Publication number: 20190362998
    Abstract: The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.
    Type: Application
    Filed: May 4, 2019
    Publication date: November 28, 2019
    Applicant: BESI Switzerland AG
    Inventors: Harald HANDLOS, Florian SPEER, Juergen STUERNER
  • Publication number: 20190157122
    Abstract: A bonding head for mounting components comprises a shaft and a housing part in which the shaft is supported. The bearing of the shaft enables a rotation of the shaft about an axis and a displacement of the shaft in the longitudinal direction of the axis by a predetermined stroke. The bonding head further comprises an electric motor with a stator attached to the housing part and a rotor attached to the shaft, an encoder for measuring the rotational position of the shaft, and a force generator for applying a force to the shaft. The stator comprises coils to which currents can be applied, the rotor comprises a plurality of permanent magnets. A length of the permanent magnets measured in the longitudinal direction of the axis is shorter or longer than an effective length of the coils measured in the longitudinal direction of the axis by at least the stroke.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 23, 2019
    Applicant: BESI Switzerland AG
    Inventor: Rene KROEHNERT
  • Patent number: 10288413
    Abstract: An apparatus for mounting components on a substrate comprises a pick and place system with a bonding head, a camera and two optical deflection systems. The first optical deflection system and the camera form a first image detection system for recording an image of the substrate location on which the component is to be mounted. The first optical deflection system, the second optical deflection system and the camera form a second image detection system for recording an image of a bottom side of the component. The pick and place system moves the carriage from a take-up location of the component to the substrate location in a respective predetermined height H1 above the second optical deflection system, so that the bottom side of the component is located in a focal plane of the camera, and lifts the carriage to a respective predetermined height H2, so that the substrate location is situated in the focal plane of the camera.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: May 14, 2019
    Assignee: Besi Switzerland AG
    Inventors: Norbert Bilewicz, Hubert Selhofer
  • Publication number: 20180317353
    Abstract: The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.
    Type: Application
    Filed: April 6, 2018
    Publication date: November 1, 2018
    Applicant: BESI SWITZERLAND AG
    Inventors: Norbert BILEWICZ, Andreas MAYR, Hugo PRISTAUZ, Hubert SELHOFER
  • Patent number: 9956692
    Abstract: A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 1, 2018
    Assignee: Besi Switzerland AG
    Inventors: Hannes Kostner, Dietmar Lackner, Florian Speer, Martin Widauer
  • Patent number: 9889516
    Abstract: A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: February 13, 2018
    Assignee: Besi Switzerland AG
    Inventors: Christoffer Stroemberg, Heinrich Berchtold, Charles Galea
  • Patent number: 9721819
    Abstract: The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: August 1, 2017
    Assignee: BESI SWITZERLAND AG
    Inventor: Florian Speer
  • Patent number: 9666460
    Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: May 30, 2017
    Assignee: Besi Switzerland AG
    Inventors: Guido Suter, Kevin Domancich, Daniel Andreas Scherer, Reto Weibel
  • Patent number: 9364953
    Abstract: A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: June 14, 2016
    Assignee: Besi Switzerland AG
    Inventors: Hannes Kostner, Dietmar Lackner, Florian Speer, Martin Widauer
  • Patent number: 9339885
    Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: May 17, 2016
    Assignee: Besi Switzerland AG
    Inventors: Heinrich Berchtold, Rene Betschart
  • Patent number: 9240334
    Abstract: The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: January 19, 2016
    Assignee: Besi Switzerland AG
    Inventors: Ernst Barmettler, Irving Rodriguez
  • Patent number: 9233389
    Abstract: A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: —lifting of the writing head, retracting or extending a pin, and lowering of the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially similar altitude above the substrate in the retracted state of the pin, and wherein the tip of the at least one second dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle in the extended state of the pin.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: January 12, 2016
    Assignee: Besi Switzerland AG
    Inventors: Ruedi Grueter, Christof Koster, Paul Andreas Stadler
  • Patent number: 9039867
    Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 26, 2015
    Assignee: Besi Switzerland AG
    Inventors: Ernst Barmettler, Fabian Hurschler, Brian Pulis
  • Patent number: 8925608
    Abstract: A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: January 6, 2015
    Assignee: Besi Switzerland AG
    Inventor: Andreas Mayr
  • Publication number: 20140311652
    Abstract: A method for mounting components on a substrate includes receiving a component with a suction member which is mounted on a bonding head, displacing the bonding head relative to the substrate by means of a first movement axis and a second movement axis in order to position the component in a target position above the substrate, lowering the suction member by means of a third movement axis until the component touches the substrate, producing a predetermined bonding force with which the suction member presses the component against the substrate, and displacing at least one of the bonding head and the substrate by means of at least one of the first movement axis by a corrective value W1 and the second movement axis by a corrective value W2 in order to correct an inclined position of the suction member produced during the build-up of the bonding force.
    Type: Application
    Filed: April 18, 2014
    Publication date: October 23, 2014
    Applicant: Besi Switzerland AG
    Inventors: Hannes Kostner, Andreas Mayr, Harald Meixner, Hugo Pristauz
  • Publication number: 20140305372
    Abstract: A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: lifting of the writing head, retracting or extending a pin, and lowering of the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially similar altitude above the substrate in the retracted state of the pin, and wherein the tip of the at least one second dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle in the extended state of the pin.
    Type: Application
    Filed: April 15, 2014
    Publication date: October 16, 2014
    Applicant: Besi Switzerland AG
    Inventors: Ruedi Grueter, Christof Koster, Paul Andreas Stadler
  • Publication number: 20140202636
    Abstract: A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: Besi Switzerland AG
    Inventor: Andreas Mayr