Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

Abstract: A 3-Dimensional multi-layered modular computer (3DMC) is disclosed that comprises removable layers of at least one CPU layer, at least one volatile memory layer, and at least one Input/Output (I/O) interface layers. The layers are stacked in parallel and are electrically connected to create a computing apparatus. Each of the layers is formed from encapsulating material having one or more internal cavities for chip dice, passive components, active components, and conductor's traces. A plurality of Thermal Conducting Rods (TCRs) is capable of conducting and removing heat generated by the components in the layers from the 3DMC apparatus to an external medium. Each TCR perpendicularly passes through the layers.