Patents Assigned to BIOCIRCUIT TECHNOLOGIES, INC.
-
Patent number: 12295733Abstract: Systems, devices, and methods for interfacing with biological tissue are described herein. An example electrode patch as described herein includes a flexible substrate and an electrode array arranged on the flexible substrate. The electrode array includes a plurality of electrodes, where each of the plurality of electrodes is formed of a hydrogel. Additionally, each of the plurality of electrodes defines a raised geometry. Additionally, an example system includes the electrode patch, which is configured to interface with a subject's skin, and an electronics module operably coupled to the electrode array.Type: GrantFiled: March 21, 2023Date of Patent: May 13, 2025Assignee: BioCircuit Technologies, Inc.Inventors: Isaac Perry Clements, Anna Harrison, Edgar Brown, Amanda Preyer, James David Ross, Andrew Willsie, Maximilian Sonntag
-
Patent number: 12161862Abstract: An example device for repairing a tissue is described herein. The device can include a flexible carrier layer, and a support member including a plurality of micro-protrusions extending therefrom. The support member can be at least partially integrated with the flexible carrier layer. Additionally, the flexible carrier layer can be configured to cover at least a portion of the tissue, and the micro-protrusions can be configured to mechanically interface with the tissue.Type: GrantFiled: February 20, 2024Date of Patent: December 10, 2024Assignees: BioCircuit Technologies, Inc., Virginia Commonwealth UniversityInventors: Jonathan Isaacs, Isaac Perry Clements, Andrew Willsie, James David Ross, Alex Weidenbach
-
Patent number: 11918801Abstract: An example device for repairing a tissue is described herein. The device can include a flexible carrier layer, and a support member including a plurality of micro-protrusions extending therefrom. The support member can be at least partially integrated with the flexible carrier layer. Additionally, the flexible carrier layer can be configured to cover at least a portion of the tissue, and the micro-protrusions can be configured to mechanically interface with the tissue.Type: GrantFiled: November 5, 2021Date of Patent: March 5, 2024Assignees: BioCircuit Technologies, Inc., Virginia Commonwealth UniversityInventors: Jonathan Isaacs, Isaac Perry Clements, Andrew Willsie, James David Ross, Alex Weidenbach
-
Patent number: 11612344Abstract: Systems, devices, and methods for interfacing with biological tissue are described herein. An example electrode patch as described herein includes a flexible substrate and an electrode array arranged on the flexible substrate. The electrode array includes a plurality of electrodes, where each of the plurality of electrodes is formed of a hydrogel. Additionally, each of the plurality of electrodes defines a raised geometry. Additionally, an example system includes the electrode patch, which is configured to interface with a subject's skin, and an electronics module operably coupled to the electrode array.Type: GrantFiled: November 4, 2019Date of Patent: March 28, 2023Assignee: BioCircuit Technologies, Inc.Inventors: Isaac Perry Clements, Anna Harrison, Edgar Brown, Amanda Preyer, James David Ross, Andrew Willsie, Maximilian Sonntag
-
Patent number: 11167131Abstract: An example device for repairing a tissue is described herein. The device can include a flexible carrier layer, and a support member including a plurality of micro-protrusions extending therefrom. The support member can be at least partially integrated with the flexible carrier layer. Additionally, the flexible carrier layer can be configured to cover at least a portion of the tissue, and the micro-protrusions can be configured to mechanically interface with the tissue.Type: GrantFiled: May 3, 2021Date of Patent: November 9, 2021Assignees: BioCircuit Technologies, Inc., Virginia Commonwealth UniversityInventors: Jonathan Isaacs, Isaac Perry Clements, Andrew Willsie, James David Ross, Alex Weidenbach
-
Patent number: 10994130Abstract: An example device for repairing a nerve is described herein. The device can include a flexible carrier layer made of a biologic material, and a metallic support member including a plurality of micro-protrusions extending therefrom. The metallic support member can be at least partially integrated with the flexible carrier layer. Additionally, the flexible carrier layer can be configured to cover at least a portion of the nerve, and the micro-protrusions can be configured to attach to a superficial tissue of the nerve.Type: GrantFiled: September 6, 2017Date of Patent: May 4, 2021Assignees: BioCircuit Technologies, Inc., Virginia Commonwealth UniversityInventors: Isaac Perry Clements, Andrew Willsie, James David Ross, Alex Weidenbach, Jonathan Isaacs
-
Patent number: 10959631Abstract: A neural interfacing device is disclosed. The neural interfacing device may include at least one microneedle electrode. The microneedle electrode may have one or more microneedles. The one or more microneedles may be shaped and positioned such that when the neural interfacing device is applied to a nerve, the one or more microneedles penetrate a nerve epineurium without any portion of the microneedle electrode penetrating any nerve axon beyond a depth of 500 micrometers.Type: GrantFiled: February 2, 2015Date of Patent: March 30, 2021Assignees: BIOCIRCUIT TECHNOLOGIES, INC., GEORGIA TECH RESEARCH CORPORATIONInventors: Robert J. Butera, Yogi A. Patel, James D. Ross, Swaminathan Rajaraman, Isaac Clements