Abstract: A heat-dissipating device for a central processing unit chip includes a plurality of heat-dissipating fins. Each fin has at least one through-hole, a lower edge, and a flange connected perpendicularly to the lower edge. At least one rod member passes through the through-hole of the fins so that the fins can be stacked together and spaced apart from one another by the flanges of the fins, with the lower edges of the fins being co-planar. Two connecting members are connected detachably to the two outermost fins. Two ends of the rod member pass through the connecting members. Each of the connecting members has a clamping portion which clamps onto the lower face of the chip so that the upper face of the chip can abut the lower edges of the fins.