Patents Assigned to Biosolutions Co., Ltd
  • Patent number: 10596224
    Abstract: Provided are a pharmaceutical composition for wound healing including a surfactant, an antioxidant, a thickener, and SP, a method of treating a wound including administering the pharmaceutical composition to a subject, and a quasi-drug composition for wound healing including a surfactant, an antioxidant, a thickener, and substance. The pharmaceutical composition of the present invention reduces a wound size, generates new blood vessels, shows dermal and epidermal regeneration effects, matures granulation tissues, and synthesizes collagen, and thus may be used for wound healing.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 24, 2020
    Assignee: Biosolutions Co., Ltd
    Inventors: Da Jung Kim, Ji Hae Jang, Jung Sun Lee, Song Sun Jang
  • Publication number: 20180140658
    Abstract: Provided are a pharmaceutical composition for wound healing including a surfactant, an antioxidant, a thickener, and SP, a method of treating a wound including administering the pharmaceutical composition to a subject, and a quasi-drug composition for wound healing including a surfactant, an antioxidant, a thickener, and substance. The pharmaceutical composition of the present invention reduces a wound size, generates new blood vessels, shows dermal and epidermal regeneration effects, matures granulation tissues, and synthesizes collagen, and thus may be used for wound healing.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 24, 2018
    Applicant: Biosolution Co., Ltd
    Inventors: Da Jung Kim, Ji Hae Jang, Jung Sun Lee, Song Sun Jang