Abstract: Provided are a pharmaceutical composition for wound healing including a surfactant, an antioxidant, a thickener, and SP, a method of treating a wound including administering the pharmaceutical composition to a subject, and a quasi-drug composition for wound healing including a surfactant, an antioxidant, a thickener, and substance. The pharmaceutical composition of the present invention reduces a wound size, generates new blood vessels, shows dermal and epidermal regeneration effects, matures granulation tissues, and synthesizes collagen, and thus may be used for wound healing.
Type:
Grant
Filed:
January 10, 2018
Date of Patent:
March 24, 2020
Assignee:
Biosolutions Co., Ltd
Inventors:
Da Jung Kim, Ji Hae Jang, Jung Sun Lee, Song Sun Jang
Abstract: Provided are a pharmaceutical composition for wound healing including a surfactant, an antioxidant, a thickener, and SP, a method of treating a wound including administering the pharmaceutical composition to a subject, and a quasi-drug composition for wound healing including a surfactant, an antioxidant, a thickener, and substance. The pharmaceutical composition of the present invention reduces a wound size, generates new blood vessels, shows dermal and epidermal regeneration effects, matures granulation tissues, and synthesizes collagen, and thus may be used for wound healing.
Type:
Application
Filed:
January 10, 2018
Publication date:
May 24, 2018
Applicant:
Biosolution Co., Ltd
Inventors:
Da Jung Kim, Ji Hae Jang, Jung Sun Lee, Song Sun Jang