Patents Assigned to BITMAIN TECHNOLOGIES INC.
  • Publication number: 20230388137
    Abstract: A computing apparatus and method for proof of work, and a chip are provided. The computing apparatus includes: N selectors, respectively configured to obtain N groups of first input quantities; and N first compressors, respectively connected to the N selectors, and respectively configured to receive the N groups of first input quantities sent by the N selectors, and to receive a same second input quantity, wherein each first compressor is configured to sequentially perform compression processing on the second input quantity and each first input quantity in one group of first input quantities, and compression processing results of the N first compressors each is used to obtain a proof-of-work result.
    Type: Application
    Filed: August 15, 2023
    Publication date: November 30, 2023
    Applicant: BITMAIN TECHNOLOGIES INC.
    Inventors: Xufeng Wu, Cunyong Yang, Ketuan Zhan
  • Publication number: 20230333623
    Abstract: The present invention discloses a power supply circuit, a chip and an electronic device. The circuit comprises: a power module, configured to supply power to a computing chip in serial connection; a first power management module, connected with the power module and the computing chip, and configured to supply power to a core of the computing chip according to a voltage provided by the power module; and at least one second power management module, connected with the power module and the computing chip, and configured to supply power to at least one voltage domain of the computing chip according to the voltage provided by the power module correspondingly before the first power management module supplies power to the core.
    Type: Application
    Filed: November 16, 2021
    Publication date: October 19, 2023
    Applicant: Bitmain Technologies Inc.
    Inventors: Bin YANG, Xiangchao LIU, Fei WU
  • Publication number: 20230297160
    Abstract: A chip power supply circuit and an electronic device are provided. The chip power supply circuit includes: one or more chips each comprising a first power supply pin and a second power supply pin; a first voltage regulator circuit connected to the first power supply pin of a corresponding chip of the one or more chips; and a second voltage regulator circuit, where the first power supply pin of the corresponding chip of the one or more chips is connected to the second power supply pin of the corresponding chip via the second voltage regulator circuit, and the second voltage regulator circuit is configured to convert the first voltage into a second voltage. The first voltage regulator circuit and the second voltage regulator circuit are respectively located on different sides of at least one of the one or more chips.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Applicant: Bitmain Technologies Inc.
    Inventors: Lijun Wang, Fei Wu
  • Publication number: 20230297153
    Abstract: Provided are a chip, a series power supply circuit, a data processing device, and a computer server. The chip includes a plurality of units to be powered, the plurality of units to be powered are connected in parallel, and a voltage domain forms on each unit to be powered. Each unit to be powered is connected to a voltage regulation unit in series, and during power-on of the chip, the voltage regulation unit is regulated to control power-on time of the plurality of units to be powered.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Applicant: Bitmain Technologies Inc.
    Inventors: Fei Wu, Lijun Wang
  • Publication number: 20230297150
    Abstract: Provided are a chip power supply circuit and an electronic device, which relate to the field of power supply technologies. The chip power supply circuit includes: at least two chip domains, where the at least two chip domains are sequentially connected, and in two adjacent chip domains, a ground port of a previous-stage chip domain is connected to a primary power supply port of a next-stage chip domain; and at least one voltage conversion circuit, where in the two adjacent chip domains, the ground port of the previous-stage chip domain is connected to a secondary power supply port of the next-stage chip domain through a voltage conversion circuit of the at least one voltage conversion circuit, and the voltage conversion circuit is configured to output a target voltage to the secondary power supply port.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Applicant: Bitmain Technologies Inc.
    Inventors: Lijun Wang, Fei WU
  • Publication number: 20230039583
    Abstract: The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.
    Type: Application
    Filed: March 15, 2021
    Publication date: February 9, 2023
    Applicant: Bitmain Technologies Inc.
    Inventors: Yongbo GE, Mingliang HAO, Lei ZHANG, Yafang FAN, Hongyu XIU, Guohui WANG
  • Publication number: 20220304182
    Abstract: The present application discloses a case assembly for a server and a server having same. The case assembly (100) is divided into a first case body (10) and a second case body (20) in a first direction, both a side of the first case body (10) that faces the second case body (20) and a side of the second case body (20) that faces the first case body (10) are open, and the first case body (10) and the second case body (20) are detachably connected and jointly define an accommodation space.
    Type: Application
    Filed: August 22, 2019
    Publication date: September 22, 2022
    Applicant: BITMAIN TECHNOLOGIES INC.
    Inventors: Jianjun Pan, Lei Zhang, Xudong Wang
  • Patent number: 11196553
    Abstract: A command transmission method and apparatus, and an electronic device. The command transmission method includes: acquiring, by a control terminal, an encryption key according to a present time; generating, by the control terminal, an encrypted control command by encrypting the control command using the encryption key; and transmitting the encrypted control command to a computing device.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: December 7, 2021
    Assignee: Bitmain Technologies Inc.
    Inventors: Zhong Zhuang, Fuyi Liu, Yihao Peng
  • Patent number: 11188131
    Abstract: A power stage circuit and a calculation board. The power stage circuit includes an input circuit and an output circuit. The input circuit and the output circuit are electrically connected. The power stage circuit also includes a plurality of package pins. The plurality of package pins are respectively connected to the input circuit, the output circuit, and a power supply package unit.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: November 30, 2021
    Assignee: Bitmain Technologies Inc.
    Inventors: Xin Chang, Yanhong Qiu, Tong Zou
  • Patent number: 11152278
    Abstract: A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: October 19, 2021
    Assignee: Bitmain Technologies Inc.
    Inventors: Tong Zou, Micree Zhan, Wenjie Cheng
  • Publication number: 20200235031
    Abstract: A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Applicant: Bitmain Technologies Inc.
    Inventors: Tong ZOU, Micree ZHAN, Wenjie CHENG
  • Publication number: 20200228330
    Abstract: A command transmission method and apparatus, and an electronic device. The command transmission method includes: acquiring, by a control terminal, an encryption key according to a present time; generating, by the control terminal, an encrypted control command by encrypting the control command using the encryption key; and transmitting the encrypted control command to a computing device.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 16, 2020
    Applicant: Bitmain Technologies Inc.
    Inventors: Zhong ZHUANG, Fuyi LIU, Yihao PENG
  • Patent number: D892753
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: August 11, 2020
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Haitang Hu, Tong Zou
  • Patent number: D906251
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: December 29, 2020
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Jiahai Su, Zhenhui Li, Changjiang Ge, Yong Luo
  • Patent number: D915766
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: April 13, 2021
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Jiahai Su, Guanchao Zhao, Guosong Lin, Minghui Sun, Zhenhui Li
  • Patent number: D964344
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: September 20, 2022
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Xingsong Fu, Xiangchao Liu, Lei Zhang
  • Patent number: D973654
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: December 27, 2022
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventor: Lianchen Li
  • Patent number: D979561
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: February 28, 2023
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventor: Haitang Hu
  • Patent number: D1007435
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: December 12, 2023
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Shaoming Huang, Hongbo Zeng, Mingliang Hao, Hangkong Hu, Yurong Peng, Zhihao Zhu
  • Patent number: D1007436
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: December 12, 2023
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Shaoming Huang, Hongbo Zeng, Mingliang Hao, Hangkong Hu, Yurong Peng, Zhihao Zhu