Abstract: The present application discloses a sand removal device for a cooling tower and the sand removal device comprises a flushing assembly and a cyclone sand removal assembly. The flushing assembly comprises a first pipeline with a plurality of water outlets, and the first pipeline is used to spray liquid towards the bottom of the cooling tower through the plurality of water outlets. The cyclone sand removal assembly is used to extract the liquid at the bottom of the cooling tower, perform a sand removal treatment on the liquid and then discharge the sand-removed liquid into the bottom of the cooling tower. Through the present application, the sand removal effect on the liquid can be improved.

Abstract: A connector, a connector assembly, a liquid cooled plate, and a liquid cooled server, where the connector includes a first connector body, a ball body, and a mesh baffle, where an annular protrusion part is provided inside the first connector body and forms an annular through-hole, and the ball body is disposed in a hollow inner cavity and is limited by the annular protrusion part and the mesh baffle; when fluid enters from a first inlet, the ball body is away from the annular through-hole to form an opened passage, and when the fluid enters from a first outlet, the ball body blocks the annular through-hole to form a closed passage. The connector assembly includes a first connector and a second connector, the first connector adopts the connector above, the second connector includes a cut elastic retaining ring for dividing the elastic retaining ring into a plurality of blades.

Abstract: Provided is a server (100), which is applicable to the technical field of electronic devices. The server (100) includes a server main body (110), a power supply (120), and a heat conduction layer (130), where the server main body (110) includes a chassis (111), a first circuit board assembly (112), and a heat dissipation fan assembly (113); the first circuit board assembly (112) is installed in the chassis (111); and the heat dissipation fan assembly (113) is installed on the chassis (111) to dissipate heat of the first circuit board assembly (112). The power supply (120) is installed on one side of the chassis (111); and the heat conduction layer (130) is arranged between the power supply (120) and the chassis (111) to conduct heat generated by the power supply (120) to the chassis (111).

Abstract: The present application provides a cooling device. The cooling device includes a first plate body and a second plate body, where a first surface of the first plate body is provided with a flow channel, the flow channel is configured to accommodate fluid, the flow channel includes at least two straight segments and at least one bent segment, the at least two straight segments are communicated via the at least one bent segment, the first surface of the first plate body is in contact with the second plate body. The cooling device of the present application has an enhanced heat dissipation performance.

Abstract: The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.

Abstract: Embodiments of the present disclosure provide an electronic device control method and apparatus, an electronic device, and a storage medium. The electronic device control method includes: selecting a target mode from optional modes of a fan of an electronic device, the optional modes including a cleaning mode and a heat dissipation mode, where in the cleaning mode, the fan provides at least two different air strengths, and in the heat dissipation mode, the fan provides a single air strength when a heat dissipation level is not switched; generating a control signal based on the target mode; and controlling, based on the control signal, the fan to provide an air strength.

Abstract: The present disclosure provides a wind power generation apparatus, including: at least two support platforms, stacked along a first direction; a wind turbine and a support frame, arranged between two adjacent support platforms; where the support frame is connected between the two adjacent support platforms; the wind turbine is detachably connected to one of the two adjacent support platforms, and spaced apart from the support frame and the other of the two adjacent support platforms. In an embodiment of the present disclosure, a difficulty of disassembling the wind turbine in the wind power generation apparatus may be reduced.

Abstract: A computing apparatus and method for proof of work, and a chip are provided. The computing apparatus includes: N selectors, respectively configured to obtain N groups of first input quantities; and N first compressors, respectively connected to the N selectors, and respectively configured to receive the N groups of first input quantities sent by the N selectors, and to receive a same second input quantity, wherein each first compressor is configured to sequentially perform compression processing on the second input quantity and each first input quantity in one group of first input quantities, and compression processing results of the N first compressors each is used to obtain a proof-of-work result.

Abstract: The present disclosure provides a circuit board assembly, relating to the field of electronic devices, the circuit board assembly includes: a circuit board; a chip, fixedly connected to the circuit board; a current-carrying component, fixedly connected to the circuit board; a heat dissipation component, fixedly connected to the chip and the current-carrying component. The heat dissipation component of this circuit board assembly has a larger connection area, which improves the connection reliability of the heat dissipation component.

Abstract: A delay circuit, a pulse generation circuit, a chip, and a server is disclosed. The delay circuit includes a control unit and at least two delay sub-circuits. Input ends of the delay sub-circuits are connected to each other. Output ends of the delay sub-circuits are connected to each other. The output end of each delay sub-circuit is connected to an input end of an adjacent delay sub-circuit through a switch unit. Each delay sub-circuit includes a delay unit and a switch unit. The delay unit is configured to perform delay processing on an input pulse signal. The switch unit is configured to control the delay sub-circuit to or not to be connected. The control unit is connected to all the switch units, and is configured to separately control a plurality of switch units to be turned on or off, so as to perform corresponding delay processing on the pulse signal.

Abstract: Provided is a dynamic latch, including: a substrate; a data transmission unit, including a first transmission gate and a second transmission gate, in which an input end of the first transmission gate is connected to an input end of the second transmission gate, and an output end of the first transmission gate is connected to an output end of the second transmission gate; a data output unit, including a first inverter, in which an input end of the first inverter is connected to the output ends of the two transmission gates, a first region of the substrate is adjacent to a second region thereof and oxide diffusion regions in two regions are continuous, drain regions of the two transmission gates are respectively located on opposite sides in the first region, and source regions of the two transmission gates are located between the drain regions of the two transmission gates.

Abstract: Provided are a chip power supply circuit and an electronic device, which relate to the field of power supply technologies. The chip power supply circuit includes: at least two chip domains, where the at least two chip domains are sequentially connected, and in two adjacent chip domains, a ground port of a previous-stage chip domain is connected to a primary power supply port of a next-stage chip domain; and at least one voltage conversion circuit, where in the two adjacent chip domains, the ground port of the previous-stage chip domain is connected to a secondary power supply port of the next-stage chip domain through a voltage conversion circuit of the at least one voltage conversion circuit, and the voltage conversion circuit is configured to output a target voltage to the secondary power supply port.

Abstract: The present disclosure provides a wind power generation apparatus, including a fan configured to obtain wind energy; a first generator, connected with the fan and a load and configured to convert the wind energy obtained by the fan into first electric energy and output the first electric energy to the load; a gas storage module, connected between the first generator and the load and configured to store or release gas; where when an output power of the first generator is greater than a load power of the load, the first generator drives the gas storage module to store a gas; and when the output power of the first generator is lower than the load power, the gas storage module releases a stored gas to generate second electric energy and output the second electric energy to the load.

Abstract: A supercomputing device, an in-place detection method for a computing power board, and a storage medium are provided. The supercomputing device includes: at least one computing power board including a first-type signal pin and a second-type signal pin, where the first-type signal pin has a different length from that of the second-type signal pin; a computing power board interface inserted into the computing power board interface; a level detection circuit electrically connected to the computing power board interface; and a master control circuit being connected to the level detection circuit, where the level detection circuit is configured to detect a first level signal corresponding to the first-type signal pin and a second level signal corresponding to the second-type signal pin, and the master control circuit determines in-place information of the computing power board based on the first level signal and the second level signal.

Abstract: The present application discloses a power supply circuit, a chip and an electronic device. The circuit comprises: a power module, configured to supply power to a computing chip in serial connection; a first power management module, connected with the power module and the computing chip, and configured to supply power to a core of the computing chip according to a voltage provided by the power module; and at least one second power management module, connected with the power module and the computing chip, and configured to supply power to at least one voltage domain of the computing chip according to the voltage provided by the power module correspondingly before the first power management module supplies power to the core.