Abstract: The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Abstract: A chip power supply circuit and an electronic device are provided. The chip power supply circuit includes: one or more chips each comprising a first power supply pin and a second power supply pin; a first voltage regulator circuit connected to the first power supply pin of a corresponding chip of the one or more chips; and a second voltage regulator circuit, where the first power supply pin of the corresponding chip of the one or more chips is connected to the second power supply pin of the corresponding chip via the second voltage regulator circuit, and the second voltage regulator circuit is configured to convert the first voltage into a second voltage. The first voltage regulator circuit and the second voltage regulator circuit are respectively located on different sides of at least one of the one or more chips.

Abstract: Provided are a chip, a series power supply circuit, a data processing device, and a computer server. The chip includes a plurality of units to be powered, the plurality of units to be powered are connected in parallel, and a voltage domain forms on each unit to be powered. Each unit to be powered is connected to a voltage regulation unit in series, and during power-on of the chip, the voltage regulation unit is regulated to control power-on time of the plurality of units to be powered.

Abstract: Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).

Abstract: Embodiments of the present application relates to a chip heat dissipation structure, a chip structure, a circuit board, and a supercomputing device, and the chip heat dissipation structure includes: a plating layer covering a wafer of the chip; where the plating layer includes a first metal layer, a second metal layer, and a third metal layer sequentially arranged. Three metal layers are added on a top of the chip by physical sputtering, so that a heat sink can be welded on the metal layers by a solder layer, and then the heat sink is fixed on the top of the chip; a main component of the solder layer is metal tin, and the metal layer have a higher thermal conductivity than an epoxy adhesive material mounted on a conventional heat sink.

Abstract: The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a metal layer, where the metal layer is covered on the chip. By adding a metal layer on the top of the chip, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip and preventing a large amount of heat from damaging the chip.

Abstract: The present application discloses a case assembly for a server and a server having same. The case assembly (100) is divided into a first case body (10) and a second case body (20) in a first direction, both a side of the first case body (10) that faces the second case body (20) and a side of the second case body (20) that faces the first case body (10) are open, and the first case body (10) and the second case body (20) are detachably connected and jointly define an accommodation space.

Abstract: A computing apparatus and method for proof of work, and a chip are provided. The computing apparatus includes: N selectors, respectively configured to obtain N groups of first input quantities; and N first compressors, respectively connected to the N selectors, and respectively configured to receive the N groups of first input quantities sent by the N selectors, and to receive a same second input quantity, wherein each first compressor is configured to sequentially perform compression processing on the second input quantity and each first input quantity in one group of first input quantities, and compression processing results of the N first compressors each is used to obtain a proof-of-work result.

Abstract: The present invention discloses a power supply circuit, a chip and an electronic device. The circuit comprises: a power module, configured to supply power to a computing chip in serial connection; a first power management module, connected with the power module and the computing chip, and configured to supply power to a core of the computing chip according to a voltage provided by the power module; and at least one second power management module, connected with the power module and the computing chip, and configured to supply power to at least one voltage domain of the computing chip according to the voltage provided by the power module correspondingly before the first power management module supplies power to the core.

Abstract: Provided are a chip power supply circuit and an electronic device, which relate to the field of power supply technologies. The chip power supply circuit includes: at least two chip domains, where the at least two chip domains are sequentially connected, and in two adjacent chip domains, a ground port of a previous-stage chip domain is connected to a primary power supply port of a next-stage chip domain; and at least one voltage conversion circuit, where in the two adjacent chip domains, the ground port of the previous-stage chip domain is connected to a secondary power supply port of the next-stage chip domain through a voltage conversion circuit of the at least one voltage conversion circuit, and the voltage conversion circuit is configured to output a target voltage to the secondary power supply port.

Abstract: A chip power supply circuit and an electronic device are provided. The chip power supply circuit includes: one or more chips each comprising a first power supply pin and a second power supply pin; a first voltage regulator circuit connected to the first power supply pin of a corresponding chip of the one or more chips; and a second voltage regulator circuit, where the first power supply pin of the corresponding chip of the one or more chips is connected to the second power supply pin of the corresponding chip via the second voltage regulator circuit, and the second voltage regulator circuit is configured to convert the first voltage into a second voltage. The first voltage regulator circuit and the second voltage regulator circuit are respectively located on different sides of at least one of the one or more chips.

Abstract: Provided are a chip, a series power supply circuit, a data processing device, and a computer server. The chip includes a plurality of units to be powered, the plurality of units to be powered are connected in parallel, and a voltage domain forms on each unit to be powered. Each unit to be powered is connected to a voltage regulation unit in series, and during power-on of the chip, the voltage regulation unit is regulated to control power-on time of the plurality of units to be powered.

Abstract: The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.

Abstract: The present application discloses a case assembly for a server and a server having same. The case assembly (100) is divided into a first case body (10) and a second case body (20) in a first direction, both a side of the first case body (10) that faces the second case body (20) and a side of the second case body (20) that faces the first case body (10) are open, and the first case body (10) and the second case body (20) are detachably connected and jointly define an accommodation space.