Abstract: A computing apparatus and method for proof of work, and a chip are provided. The computing apparatus includes: N selectors, respectively configured to obtain N groups of first input quantities; and N first compressors, respectively connected to the N selectors, and respectively configured to receive the N groups of first input quantities sent by the N selectors, and to receive a same second input quantity, wherein each first compressor is configured to sequentially perform compression processing on the second input quantity and each first input quantity in one group of first input quantities, and compression processing results of the N first compressors each is used to obtain a proof-of-work result.

Abstract: The present disclosure provides a circuit board assembly, relating to the field of electronic devices, the circuit board assembly includes: a circuit board; a chip, fixedly connected to the circuit board; a current-carrying component, fixedly connected to the circuit board; a heat dissipation component, fixedly connected to the chip and the current-carrying component. The heat dissipation component of this circuit board assembly has a larger connection area, which improves the connection reliability of the heat dissipation component.

Abstract: A delay circuit, a pulse generation circuit, a chip, and a server is disclosed. The delay circuit includes a control unit and at least two delay sub-circuits. Input ends of the delay sub-circuits are connected to each other. Output ends of the delay sub-circuits are connected to each other. The output end of each delay sub-circuit is connected to an input end of an adjacent delay sub-circuit through a switch unit. Each delay sub-circuit includes a delay unit and a switch unit. The delay unit is configured to perform delay processing on an input pulse signal. The switch unit is configured to control the delay sub-circuit to or not to be connected. The control unit is connected to all the switch units, and is configured to separately control a plurality of switch units to be turned on or off, so as to perform corresponding delay processing on the pulse signal.

Abstract: Provided is a dynamic latch, including: a substrate; a data transmission unit, including a first transmission gate and a second transmission gate, in which an input end of the first transmission gate is connected to an input end of the second transmission gate, and an output end of the first transmission gate is connected to an output end of the second transmission gate; a data output unit, including a first inverter, in which an input end of the first inverter is connected to the output ends of the two transmission gates, a first region of the substrate is adjacent to a second region thereof and oxide diffusion regions in two regions are continuous, drain regions of the two transmission gates are respectively located on opposite sides in the first region, and source regions of the two transmission gates are located between the drain regions of the two transmission gates.

Abstract: Provided are a chip power supply circuit and an electronic device, which relate to the field of power supply technologies. The chip power supply circuit includes: at least two chip domains, where the at least two chip domains are sequentially connected, and in two adjacent chip domains, a ground port of a previous-stage chip domain is connected to a primary power supply port of a next-stage chip domain; and at least one voltage conversion circuit, where in the two adjacent chip domains, the ground port of the previous-stage chip domain is connected to a secondary power supply port of the next-stage chip domain through a voltage conversion circuit of the at least one voltage conversion circuit, and the voltage conversion circuit is configured to output a target voltage to the secondary power supply port.

Abstract: The present disclosure provides a wind power generation apparatus, including a fan configured to obtain wind energy; a first generator, connected with the fan and a load and configured to convert the wind energy obtained by the fan into first electric energy and output the first electric energy to the load; a gas storage module, connected between the first generator and the load and configured to store or release gas; where when an output power of the first generator is greater than a load power of the load, the first generator drives the gas storage module to store a gas; and when the output power of the first generator is lower than the load power, the gas storage module releases a stored gas to generate second electric energy and output the second electric energy to the load.

Abstract: A supercomputing device, an in-place detection method for a computing power board, and a storage medium are provided. The supercomputing device includes: at least one computing power board including a first-type signal pin and a second-type signal pin, where the first-type signal pin has a different length from that of the second-type signal pin; a computing power board interface inserted into the computing power board interface; a level detection circuit electrically connected to the computing power board interface; and a master control circuit being connected to the level detection circuit, where the level detection circuit is configured to detect a first level signal corresponding to the first-type signal pin and a second level signal corresponding to the second-type signal pin, and the master control circuit determines in-place information of the computing power board based on the first level signal and the second level signal.

Abstract: The present application discloses a power supply circuit, a chip and an electronic device. The circuit comprises: a power module, configured to supply power to a computing chip in serial connection; a first power management module, connected with the power module and the computing chip, and configured to supply power to a core of the computing chip according to a voltage provided by the power module; and at least one second power management module, connected with the power module and the computing chip, and configured to supply power to at least one voltage domain of the computing chip according to the voltage provided by the power module correspondingly before the first power management module supplies power to the core.

Abstract: The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Abstract: A chip power supply circuit and an electronic device are provided. The chip power supply circuit includes: one or more chips each comprising a first power supply pin and a second power supply pin; a first voltage regulator circuit connected to the first power supply pin of a corresponding chip of the one or more chips; and a second voltage regulator circuit, where the first power supply pin of the corresponding chip of the one or more chips is connected to the second power supply pin of the corresponding chip via the second voltage regulator circuit, and the second voltage regulator circuit is configured to convert the first voltage into a second voltage. The first voltage regulator circuit and the second voltage regulator circuit are respectively located on different sides of at least one of the one or more chips.

Abstract: Provided are a chip, a series power supply circuit, a data processing device, and a computer server. The chip includes a plurality of units to be powered, the plurality of units to be powered are connected in parallel, and a voltage domain forms on each unit to be powered. Each unit to be powered is connected to a voltage regulation unit in series, and during power-on of the chip, the voltage regulation unit is regulated to control power-on time of the plurality of units to be powered.

Abstract: Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).

Abstract: Embodiments of the present application relates to a chip heat dissipation structure, a chip structure, a circuit board, and a supercomputing device, and the chip heat dissipation structure includes: a plating layer covering a wafer of the chip; where the plating layer includes a first metal layer, a second metal layer, and a third metal layer sequentially arranged. Three metal layers are added on a top of the chip by physical sputtering, so that a heat sink can be welded on the metal layers by a solder layer, and then the heat sink is fixed on the top of the chip; a main component of the solder layer is metal tin, and the metal layer have a higher thermal conductivity than an epoxy adhesive material mounted on a conventional heat sink.

Abstract: The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a metal layer, where the metal layer is covered on the chip. By adding a metal layer on the top of the chip, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip and preventing a large amount of heat from damaging the chip.

Abstract: The present application discloses a case assembly for a server and a server having same. The case assembly (100) is divided into a first case body (10) and a second case body (20) in a first direction, both a side of the first case body (10) that faces the second case body (20) and a side of the second case body (20) that faces the first case body (10) are open, and the first case body (10) and the second case body (20) are detachably connected and jointly define an accommodation space.