Patents Assigned to Bizlink International Corporation
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Patent number: 11626690Abstract: A cable connector configured to secure a cable is provided. The cable connector has a casing, a latch, and a pulling member. The casing is configured to secure an end of the cable. The latch has a lower portion and an upper portion. The lower portion is secured on the casing and has a lower through hole. The upper portion has at least one upper through hole and at least one protrusion. The pulling member is connected with the upper through hole and penetrates the lower through hole. While the pulling member is pulled away from the latch along a first direction, the pulling member pulls the upper portion toward the lower portion along a second direction, so as to adjust a position of the protrusion. Thus, the latch may not be separated from the casing when a user pulls the pulling member.Type: GrantFiled: November 30, 2021Date of Patent: April 11, 2023Assignee: Bizlink International CorporationInventors: Hsin Tuan Hsiao, Jui Hung Chien
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Publication number: 20220393385Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.Type: ApplicationFiled: August 18, 2022Publication date: December 8, 2022Applicant: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
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Patent number: 11523538Abstract: A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.Type: GrantFiled: November 16, 2020Date of Patent: December 6, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan Hsiao, Jui-Hung Chien
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Patent number: 11493961Abstract: A docking station has a base, a main casing, a cover body, a ventilation layer, and multiple first lateral openings. The main casing forms a first inner space and has multiple first through-holes. The ventilation layer is in gaseous communication with the first inner space via the first through-holes. The cover body is fixed to the main casing, and the ventilation layer is formed between the cover body and the main casing. The first lateral openings are formed in the cover body and in gaseous communication with the ventilation layer. When in use, heat generated by electronic components inside the first inner space makes air inside the first inner space flow upwards to the ventilation layer and subsequently exits the docking station via the first lateral openings. Meanwhile, cool air enters the first inner space via the first lateral openings to dissipate heat.Type: GrantFiled: February 16, 2021Date of Patent: November 8, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventors: Kuo-Liang Tseng, Yu-Shih Chin
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Patent number: 11454774Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.Type: GrantFiled: November 17, 2020Date of Patent: September 27, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan Hsiao, Jui-Hung Chien
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Patent number: 11381097Abstract: The invention discloses a docking device and a charging management method thereof, including a first connection port, a second connection port, at least one peripheral equipment connection port, a power converter, a temperature sensor and a processor. The first connection port and the second connection port are both USB Type-C connectors, connected to a host and an external power respectively. When a real temperature value sensed by the temperature sensor rises to an upper temperature threshold, the processor controls the first connection port, the second connection port, and the peripheral equipment connection port coordinately according to USB-C power delivery protocol, requests an input voltage of the second connection port to be equal to the peripheral device voltage, and transmits the input voltage to the peripheral equipment connection port via the power converter. Neither does the power converter generate conversion loss nor does the docking device increase power loss and heat.Type: GrantFiled: June 11, 2020Date of Patent: July 5, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventor: Ming-Tso Hsu
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Patent number: 11381027Abstract: An electronic connector has a first shell, a second shell, a space, and at least one fixing unit. The first shell has a cover segment and at least one first assembling segment mounted securely on the cover segment. The second shell has at least one second assembling segment arranged with the first assembling segment of the first shell along the width direction of the electronic connector. The space is formed between the cover segment of the first shell and the second shell. The first assembling segment of the first shell is located in the space. The fixing unit is mounted through the first assembling segment of the first shell and the second assembling segment of the second shell along the width direction. Therefore, wires will not be restricted by the first assembling segment and the second assembling segment in the width direction.Type: GrantFiled: November 23, 2020Date of Patent: July 5, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan Hsiao, Jui-Hung Chien
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Patent number: 11289840Abstract: A connector has a casing and a circuit board structure. The circuit board structure is mounted through the casing and has a board main body, a projecting body, and multiple metal electrodes. The projecting body is mounted on a connecting end surface of the board main body and projects from the connecting end surface in an insertion direction of the connector. When the connector is connected to another device, the projecting body of the circuit board structure may push a part of pins of the device first, so the user may exert less force to insert the projecting body into the device. Then, when the circuit board structure is inserted further, the board main body may abut the remaining pins. Because part of the pins have been pushed away by the projecting body, the board main body only needs to counteract resistance from the remaining pins.Type: GrantFiled: September 15, 2020Date of Patent: March 29, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin Tuan Hsiao, Chih-Feng Cheng, Jui Hung Chien
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Patent number: 11228140Abstract: An electronic device connection system has a cable, a cable connector, and an electronic device. The electronic device has a socket. When the cable connector is mounted through the socket, the cable is electrically connected to the electronic device. The cable connector has a casing, a resilient latch, and a pulling member. The casing forms a protrusion and a first engaged opening. The resilient latch forms a hooked opening and a first hook. The protrusion can be engaged in the hooked opening, and the first hook can be engaged in the first engaged opening so the resilient latch is firmly fixed on the casing. Thus, the resilient latch may not be separated from the casing when a user pulls the pulling member, which ensures that the casing will be detached from the socket when the pulling member is pulled.Type: GrantFiled: September 15, 2020Date of Patent: January 18, 2022Assignee: Bizlink International CorporationInventors: Hsin Tuan Hsiao, Jui Hung Chien
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Patent number: 11227705Abstract: A circuit board assembly has a circuit board and a high-speed cable. The high-speed cable has two signal lines, a ground conductor, an impedance-reducing conductor, and a covering material. The signal lines, the ground conductor, and the impedance-reducing conductor are mounted through the entire high-speed cable. The covering material wraps the signal lines, the ground conductor, and the impedance-reducing conductor, and has a conductive layer and an isolation layer as an inner layer and an outer layer respectively. The conductive layer has multiple loops electrically connected to the ground conductor and the impedance-reducing conductor. Thus, the impedance in the covering material, the ground conductor, and the impedance-reducing conductor is decreased, which prevents from attenuating the signal intensity during transmission at high frequency.Type: GrantFiled: August 24, 2020Date of Patent: January 18, 2022Assignee: Bizlink International CorporationInventors: Hsin Tuan Hsiao, Chih Feng Cheng
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Patent number: 11165201Abstract: An interface card is provided with an oblique-insert-proof structure. The interface card has an inserting portion configured to be inserted into a slot of a motherboard. The oblique-insert-proof structure is configured to abut the slot. The oblique-insert-proof structure has a connecting portion and two end blocking portions. The connecting portion has a groove in an inserting direction and extending in a length direction. The end blocking portions are configured to abut two shorter side surfaces of the slot. The oblique-insert-proof structure is securely mounted on the interface card and the inserting portion is mounted through the groove. When the interface card is mounted on the motherboard, the oblique-insert-proof structure can assist in aligning the inserting portion with the slot. Also, the oblique-insert-proof structure can enhance the strength of the connection between the interface card and the motherboard, so the interface card can be disposed with more components and bear more weight.Type: GrantFiled: July 20, 2020Date of Patent: November 2, 2021Assignee: Bizlink International CorporationInventors: Hsin Tuan Hsiao, Jui Hung Chien
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Publication number: 20210257773Abstract: An electronic connector has a first shell, a second shell, a space, and at least one fixing unit. The first shell has a cover segment and at least one first assembling segment mounted securely on the cover segment. The second shell has at least one second assembling segment arranged with the first assembling segment of the first shell along the width direction of the electronic connector. The space is formed between the cover segment of the first shell and the second shell. The first assembling segment of the first shell is located in the space. The fixing unit is mounted through the first assembling segment of the first shell and the second assembling segment of the second shell along the width direction. Therefore, wires will not be restricted by the first assembling segment and the second assembling segment in the width direction.Type: ApplicationFiled: November 23, 2020Publication date: August 19, 2021Applicant: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
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Publication number: 20210247577Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.Type: ApplicationFiled: November 17, 2020Publication date: August 12, 2021Applicant: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
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Publication number: 20210227717Abstract: A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.Type: ApplicationFiled: November 16, 2020Publication date: July 22, 2021Applicant: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
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Publication number: 20210175650Abstract: A connector has a casing and a circuit board structure. The circuit board structure is mounted through the casing and has a board main body, a projecting body, and multiple metal electrodes. The projecting body is mounted on a connecting end surface of the board main body and projects from the connecting end surface in an insertion direction of the connector. When the connector is connected to another device, the projecting body of the circuit board structure may push a part of pins of the device first, so the user may exert less force to insert the projecting body into the device. Then, when the circuit board structure is inserted further, the board main body may abut the remaining pins. Because part of the pins have been pushed away by the projecting body, the board main body only needs to counteract resistance from the remaining pins.Type: ApplicationFiled: September 15, 2020Publication date: June 10, 2021Applicant: BIZLINK INTERNATIONAL CORPORATIONInventors: Hsin Tuan HSIAO, Chih-Feng CHENG, Jui Hung CHIEN
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Patent number: D924196Type: GrantFiled: February 18, 2020Date of Patent: July 6, 2021Assignee: BIZLINK INTERNATIONAL CORPORATIONInventor: Shih-Yung Wang
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Patent number: D931860Type: GrantFiled: January 21, 2020Date of Patent: September 28, 2021Assignee: BIZLINK INTERNATIONAL CORPORATIONInventor: Yu-Shih Chin
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Patent number: D952555Type: GrantFiled: April 29, 2020Date of Patent: May 24, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventor: Ya-Fang Cheng
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Patent number: D958144Type: GrantFiled: February 5, 2021Date of Patent: July 19, 2022Assignee: Bizlink International CorporationInventor: Ya-Fang Cheng
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Patent number: D967057Type: GrantFiled: February 24, 2020Date of Patent: October 18, 2022Assignee: BIZLINK INTERNATIONAL CORPORATIONInventor: Ya-Fang Cheng