Abstract: Disclosed are a lead frame for a semiconductor package, comprising: an anode 10, a cathode 20, a molding part 30, terminal parts 90 and 91, wherein one or more heat radiating holes 40, one or more chip attachment parts 50 which have a wider surface area than surface areas of semiconductor chips 55 to be attached, one or more upper openings 70 and 71 are positioned in an upper portion of the lead frame, and wherein one or more heat radiating holes 40, one or more first lower openings 60, and one or more second lower openings 80 are positioned in a lower portion of the lead frame; a semiconductor package including the lead frame; and a lighting apparatus including the semiconductor package.

Abstract: The present invention relates to an LED light source structure, and more particularly, to an LED light source structure with high illuminating power and improved heat dissipating performance, in which metal having superior electric conductivity and thermal conductivity is processed into positive electrode units, and heat generated from an LED chip is directly dissipated through the electrode unit which is used as a positive electrode from among the positive electrode units, thereby improving heat dissipating characteristics, stabilizing a light source and preventing voltage drop, thus enabling output of high illuminating power.