Abstract: A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.
Type:
Grant
Filed:
November 15, 2000
Date of Patent:
July 8, 2003
Assignee:
Blasberg Oberflächentechnik GmbH
Inventors:
Jürgen Hupe, Sabine Fix, Ortrud Steinius