Abstract: A system is provided for providing vibration isolation and acceleration compensation for a device such as a vibration-sensitive oscillator or sensor. The system has an assembly that moves or vibrates relative to an external component. The assembly includes a plurality of components mounted to either side of a PCB. One or more accelerometers are configured to detect acceleration of the PCB in at least one of an X-axis direction, a Y-axis direction, and a Z-axis direction. The system includes plurality of isolators coupled to the assembly and configured to isolate or dampen vibrations that would otherwise transfer to the assembly from an underlying component to which the assembly is configured to attach to. In certain embodiments, the isolators are located between the assembly and the underlying component within vertical confines of an exterior perimeter of the PCB.

Abstract: Motion and/or orientation sensing systems can utilize gyroscopes, accelerometers, magnetometers, and other sensors for measuring motion or orientation of connected objects. Temperature changes affect the precision of the data output by the motion/orientation sensing device. A system is provided for controllably heating a device within a package to a desired temperature that varies based on the ambient temperature. The operating temperature of the device can then be known and controlled. The ambient temperature can be known through an ambient temperature sensor, for example. Given this information, a controller compensates the data output by the device to further improve the accuracy in the measurements. Like the amount of heating provided to the package, the amount of compensation is also based on the ambient temperature and/or the device temperature.

Abstract: A piezoelectric circuit has a base crystal with electroplated electrodes, at least one of which has a beta emitter such as Nickel 63 vacuum plated thereon to provide a self-powering capability. The size of the radioactive power source will be selected to enable the resonator to function without the benefit of an external power source for some applications. In other instances, the radioactive power source will be sized to enable the resonator to produce higher amplitude output to reduce the level of phase noise and improve resolution.

Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. A metallic layer of platinum or gold is bonded to an internal surface of the hermetically sealed enclosure. While either metallic layer may serve as a heating element by subjecting the electronic circuit connected thereto with a large current, the platinum layer can also be used as a thermal sensor by passing a lower current there through. An internal heater is included to stabilize the performance of the electronic components.

Abstract: A hermetic package for electronic components which is made of metallic silicon is disclosed. The package creates a cavity for receiving the electronic component, preferably a piezoelectric device, which provides a evacuated environment in the range of 1×10?5 to 1×10?11 torr. In a first embodiment, the single crystal metallic silicon is p-doped to make it electrically conductive, obviating the need for lead wires which could compromise the hermeticity of the package. Silicon-to-silicon bonding is preferably accomplished using brazing of the cover to the base member using gold indium eutectic alloy at 495° C. A method of making a surface mountable electronic component having an internal hermetic environment is also described.