Abstract: In a system having a number of semiconductor processing modules sharing a common vacuum environment, a mid-entry load lock is provided to permit insertion and removal of wafers into the vacuum environment at a point between various other robotic handlers, process modules, and load locks. This arrangement permits increased flexibility in scheduling when multiple wafers are processed concurrently.
Abstract: Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.
Abstract: Methods and systems are provided for handling an item in a vacuum-based handling system for semiconductor manufacturing. The methods include providing a heater or dryer for the load lock of the handling system that dries a semiconductor wafer during the pumping down of the load lock.
Abstract: Methods and systems are provided for handling materials in a vacuum semiconductor manufacturing process. The methods and systems include a motor drive system for a robotic component of the vacuum handling system, where the motor drive system can be removed from the robotic component without breaking the seal of the vacuum.
Abstract: Methods and systems are provided for handling an item in a vacuum-based handling system for semiconductor manufacturing. The methods include providing a heater or dryer for the load lock of the handling system that dries a semiconductor wafer during the pumping down of the load lock.
Abstract: Methods and systems are provided for a vacuum-based semiconductor handling system. The system may be a linear system with a four-link robotic SCARA arm for moving materials in the system. The system may include one or more vertically stacked load locks or vertically stacked process modules.
Abstract: Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include mid-entry load lock facilities for linear, vacuum-based handling systems.
Abstract: Methods and systems are provided for reducing the effects of vibration in a vacuum-based semiconductor handling system, including methods and systems for tapering robotic arm components and tapering end effectors of robotic arm components to reduce vibration in the same.
Abstract: Methods and systems are provided for handling materials in a semiconductor handling system. The methods include a sensor for detecting the position of a workpiece or a robotic component. The sensor may include a sensor for detecting both vertical and horizontal position of the robotic component. The sensor may be positioned outside the turn radius of the robotic component.
Abstract: Methods and systems are provided for controlling material handling systems, such as vacuum-based semiconductor handling systems. In embodiments a central software controller recognizes the addition of a component to the system, such as the addition of a process module or robotic handling facility, and can optimize material flow based on the new component. In embodiments the system may include software for visualizing and optimizing the flow of materials and/or the configuration of the system.