Abstract: The method can include obtaining a digital image of a wood board having a defect, the digital image including a representation of the defect; using a computer: mapping the position and shape of the representation of the defect, and generating blasting instructions based on the mapped position and shape; positioning the wood board in a given position in a cleaning station, the cleaning station having a blasting nozzle and holding the wood board in its coordinate system; and the cleaning station automatically moving the blasting nozzle relative to the wood board and blasting the defect based on the blasting instructions, including moving at least one of the blasting nozzle and the wood board relative to a frame of the cleaning station.

Abstract: The present invention relates to a flexible sheet of wood strips for use in the fabrication of engineered floor boards or wood sheets and including the machine and method of manufacture of the flexible sheet of wood strips. The wood strips provide a wood floor which has much more stability than a solid wood plank which is much more affected by the temperature in a room and the moisture under the floor board. Also solid wood planks are much more expensive than engineered wood planks where only a very thin layer of quality wood material is utilized. The transverse wood strips are constructed of inferior wood material. Two or more treads of flexible material may be secured transversely to the wood strips to provide additional retention of the wood strips in the flexible sheet.

Abstract: The described method of fabricating a composite engineered wood material floor board, having a top wood layer secured to a wood material substrate layer, minimizes the effect of telegraphy in the resulting floor board. The method includes selecting a top wood layer from a top surface quality wood material having a thickness of between 1 mm and 8 mm, and selecting a substrate wood material layer having a minimum thickness of 6 mm and a thickness ratio between 1:1 and 1:10 between the top wood layer and the substrate wood material layer. A plurality of transverse rectangular spaced-apart grooves are also formed in a bottom surface of said wood substrate layer. The ratio between the depth of said grooves and the thickness of the substrate wood material has an impact on telegraphy of said grooves in said top wood layer and is therefore selected accordingly.

Abstract: A composite engineered wood material piece, such as a floor board or wood material sheet, is comprised of a thin top quality wood material layer bonded onto a high density fiber board (HDF) material which is itself bonded onto a thick bottom substrate oriented strand board (OSB) material layer. The OSB material layer has its particle orientation in the top surface disposed parallel to the grain orientation in the top quality wood material layer. The HDF layer resists to the stress exhibited in the top layer and acts has a transition layer to secure the top layer to the bottom layer. It also strengthens the composite floor board or wood material sheet.

Abstract: The described method of fabricating a composite engineered wood material floor board, having a top wood layer secured to a wood material substrate layer, minimizes the effect of telegraphy in the resulting floor board. The method includes selecting a top wood layer from a top surface quality wood material having a thickness of between 1 mm to 8 mm, and selecting a substrate wood material layer having a thickness of between 6 mm and a thickness ratio of 1 to no more than 10 between the top wood layer and the substrate wood material layer. A plurality of transverse rectangular spaced-apart grooves are also formed in a bottom surface of said wood substrate layer. The ratio between the depth of said grooves and the thickness of the substrate wood material has an impact on telegraphy of said grooves in said top wood layer and is therefore selected accordingly.