Patents Assigned to BOE TECHNOLOGY GROUP CO., LDT.
  • Publication number: 20160372354
    Abstract: An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected structures which are provided on the substrate and can be slideably extended into the hollowed-out parts for pushing out IC chips; the hollowed-out parts and the projected structures cooperate to form groove structures for accomodating the IC chips. In usage, the IC chip in the groove structure are pushed out by sliding of the projected structures of the ejection mechanism through the hollowed-out parts. Thus, removing and flipping over of the IC chips is facilitated, and the processing safety of the IC chip can be ensured.
    Type: Application
    Filed: August 27, 2015
    Publication date: December 22, 2016
    Applicant: BOE TECHNOLOGY GROUP CO., LDT.
    Inventor: Yang XING