Abstract: The present disclosure provides a packaging assembly and a manufacturing method thereof. The packaging assembly comprising a first substrate, a second substrate arranged opposite to the first substrate, an electronic device located between the first substrate and the second substrate, a protective layer covering the electronic device, and a bonding layer for bonding the first substrate and the second substrate so as to realize surface-to-surface packaging. The packaging assembly further comprising an isolation layer located between the bonding layer and the protective layer and adhered to both them, wherein an adhesion force between the material for forming the isolation layer and that for forming the bonding layer is smaller than an adhesion force between the material for forming the protective layer and that for forming the bonding layer.

Abstract: The present disclosure discloses a method and system of determining a location of a line fault of a panel. The method comprises: connecting a front end point of a metal wire that is determined to have suffered the line fault to a probe of a test instrument, the other probe of the test instrument being connected to a common electrode wire; performing a fusing-off processing on the metal wire according to a preset rule; and determining the location of the line fault of the metal wire based on a variation in the readings from the test instrument upon the fusing-off of the metal wire. The system comprises: a test instrument, one probe of which being connected to a front end point of a metal wire that is determined to have suffered the line fault, the other probe of which being connected to a common electrode wire; and a laser for performing a fusing-off processing on the metal wire.