Patents Assigned to Bokang Tech Co., Ltd
  • Packing apparatus for pressure type soil-nailing and soil-nailing construction method using the packing apparatus
    Publication number: 20030235472
    Abstract: The present invention relates to a packing apparatus for pressure type soil-nailing and soil-nailing construction method using the apparatus, can shorten a grouting time through pressure type grouting which seals completely grouting area, and can improve stability of a ground reinforcing body by filling liquid grout to even a gap between a boring hole and the ground and void of the ground.
    Type: Application
    Filed: October 31, 2002
    Publication date: December 25, 2003
    Applicants: Korea Land Corporation, Bokang Tech Co., Ltd, Do Dam Engineering Co., Ltd.
    Inventor: Myung-Jae Lee