Patents Assigned to Bokwang Co., Ltd.
  • Patent number: 6397107
    Abstract: An apparatus for embolic treatment including a high frequency power source and at least one induction coil connected to the high frequency power source which is positioned around the vicinity of diseased vasculature of the body of a patient for generating an eddy current in the metallic coil inserted into the vascular malformation of the diseased vasculature. The eddy current in the metallic coil generates heat which coagulates and contracts the vascular malformation.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: May 28, 2002
    Assignee: Bokwang Co., Ltd.
    Inventors: Kyu Ho Lee, Jae Kun Lee