Patents Assigned to BONDTECH CO., LTD.
  • Publication number: 20200006099
    Abstract: A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (?Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (?Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).
    Type: Application
    Filed: January 31, 2018
    Publication date: January 2, 2020
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira YAMAUCHI
  • Patent number: 10204785
    Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: February 12, 2019
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Patent number: 9870922
    Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: January 16, 2018
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20170221856
    Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.
    Type: Application
    Filed: October 19, 2015
    Publication date: August 3, 2017
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira YAMAUCHI
  • Patent number: 9601350
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: March 21, 2017
    Assignees: BONDTECH CO., LTD., TAIYO YUDEN CO., LTD., LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Patent number: 9379082
    Abstract: A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ?D between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ?D is corrected (step S17).
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: June 28, 2016
    Assignee: Bondtech Co., Ltd.
    Inventor: Akira Yamauchi
  • Patent number: 9243894
    Abstract: A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ?D between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ?D is corrected (step S17).
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: January 26, 2016
    Assignee: BONDTECH CO., LTD.
    Inventor: Akira Yamauchi
  • Patent number: 9142532
    Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: September 22, 2015
    Assignee: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20150048523
    Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
    Type: Application
    Filed: April 24, 2013
    Publication date: February 19, 2015
    Applicant: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20140048805
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Application
    Filed: January 30, 2012
    Publication date: February 20, 2014
    Applicants: LAN TECHNICAL SERVICE CO., LTD., TAIYO YUDEN CO., LTD., BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou
  • Publication number: 20140037945
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Application
    Filed: January 30, 2012
    Publication date: February 6, 2014
    Applicants: LAN TECHNICAL SERVICE CO., LTD., TAIYO YUDEN CO., LTD., BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Publication number: 20120127485
    Abstract: A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ?D between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ?D is corrected (step S17).
    Type: Application
    Filed: March 9, 2010
    Publication date: May 24, 2012
    Applicant: BONDTECH CO., LTD.
    Inventor: Akira Yamauchi