Patents Assigned to BONDTECH CO., LTD.
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Publication number: 20240079373Abstract: Bonding system for bonding a second article to a first article, comprising an activation treatment device that comprises an object supporter that supports objects comprising the second article, and a particle beam source that activates a bonding surface of the second article by irradiating the objects with a particle beam, the objects being set on one treatment surface without being opposed to each other, followed by performing activation treatment by the particle beam source; and a bond device that brings the second article, of which the bonding surface is activated by the activation treatment device, into contact with the first article, to thereby bond the second article to the first article, wherein the object supporter supports the objects in a posture in which a portion formed of a plurality of kinds of materials comprising the bonding surface of the second article in the objects is exposed to the particle beam source.Type: ApplicationFiled: October 14, 2023Publication date: March 7, 2024Applicants: BONDTECH CO., LTD.Inventors: Akira YAMAUCHI, Tadatomo SUGA
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Publication number: 20240079374Abstract: Bonding system that bonds each of a plurality of second articles to a first article, wherein each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article, the bonding system comprises: a device for supplying a second article that supplies the plurality of second articles; a bond device that bonds the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article; and a device for transporting a second article that transports, to the bond device, at least one of the plurality of second articles supplied from the device for supplying a second article, and the device for transporting a second article comprises a holder for holding a second article that holds the uneven portion of the at least one second article.Type: ApplicationFiled: October 14, 2023Publication date: March 7, 2024Applicants: BONDTECH CO., LTD.Inventors: Akira YAMAUCHI, Tadatomo SUGA
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Publication number: 20240066624Abstract: A bonding method for bonding two substrates (W1, W2) includes: a heat treatment process of heating a bonding surface to be bonded to each other of each of the two substrates (W1, W2) to a temperature higher than 60° C. in a reduced-pressure atmosphere; an activation treatment process of activating the bonding surface of each of the two substrates (W1, W2) in a state of maintaining the reduced-pressure atmosphere after the heat treatment process; and a bonding process of bonding the two substrates (W1, W2) in a state of maintaining the reduced-pressure atmosphere after the activation treatment process. In the heat treatment process, the state of heating the bonding surface of each of the two substrates (W1, W2) to a temperature higher than 60° C. may be maintained for 30 seconds or more in a state of maintaining the reduced-pressure atmosphere. The gas pressure in the heat treatment process may be 10?2 Pa or less.Type: ApplicationFiled: January 21, 2022Publication date: February 29, 2024Applicants: BONDTECH CO., LTD.Inventors: Akira YAMAUCHI, Tadatomo SUGA
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Publication number: 20240009984Abstract: A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activation treatment step, exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time, and a bonding step of bonding the two substrates that have the bonding surfaces activated in the activation treatment step.Type: ApplicationFiled: September 10, 2021Publication date: January 11, 2024Applicants: BONDTECH CO., LTD.Inventors: Akira YAMAUCHI, Tadatomo SUGA
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Patent number: 11837444Abstract: The substrate joining method is a substrate joining method for joying two substrates, including a hydrophilic treatment step of hydrophilizing at least one of respective joint surfaces of the two substrates that are to be joined to each other and a joining step of joining the two substrates after the hydrophilic treatment step. The hydrophilic treatment step includes a step of performing a N2 RIE treatment to perform reactive ion etching using N2 gas on the joint surfaces of the substrates and a step of performing a N2 radical treatment to irradiate the joint surfaces of the substrates with N2 radicals after the step of performing the N2 RIE treatment.Type: GrantFiled: November 6, 2017Date of Patent: December 5, 2023Assignees: BONDTECH CO., LTD.Inventors: Akira Yamauchi, Tadatomo Suga
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Publication number: 20230307284Abstract: A chip bonding system (1) includes a dicing device (20) to, by dicing a dicing substrate stuck on a sheet (1E), generate a plurality of chips (CP) stuck on the sheet (1E) with chips (CP) adjacent to each other joined to each other via remaining uncut portions, an activation treatment device (60) to activate bonding surfaces of respective ones of the chips (CP) stuck to the sheet (TE), a sheet stretching device (40) to, by stretching the sheet (TE) on which the chips (CP) having bonding surfaces activated by the activation treatment device (60) are stuck, brings the chips (CP) into a state of being separated from one another, and a bonding device (30) to, by bringing one chip (CP) picked out of the chips (CP) separated from one another into contact with a substrate (WT), bond the one chip (CP) to the substrate (WT).Type: ApplicationFiled: July 29, 2021Publication date: September 28, 2023Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Publication number: 20230154770Abstract: A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.Type: ApplicationFiled: January 20, 2023Publication date: May 18, 2023Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Publication number: 20230136771Abstract: The substrate joining method is a substrate joining method for joying two substrates, including a hydrophilic treatment step of hydrophilizing at least one of respective joint surfaces of the two substrates that are to be joined to each other and a joining step of joining the two substrates after the hydrophilic treatment step. The hydrophilic treatment step includes a step of performing a N2 RIE treatment to perform reactive ion etching using N2 gas on the joint surfaces of the substrates and a step of performing a N2 radical treatment to irradiate the joint surfaces of the substrates with N2 radicals after the step of performing the N2 RIE treatment.Type: ApplicationFiled: November 6, 2017Publication date: May 4, 2023Applicants: BONDTECH CO., LTD.Inventors: Akira YAMAUCHI, Tadatomo SUGA
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Patent number: 11587804Abstract: A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.Type: GrantFiled: January 31, 2018Date of Patent: February 21, 2023Assignee: BONDTECH CO., LTD.Inventor: Akira Yamauchi
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Publication number: 20230030272Abstract: A bonding device measures a position deviation amount of the chip with respect to the substrate in a state where the chip and the substrate are in contact, and corrects and moves the chip relatively to the substrate in such a way as to reduce the position deviation amount, based on the measured position deviation amount. Then, the bonding device fixes the chip to the substrate by irradiating a resin portion of the chip with an ultraviolet ray and curing the resin portion when the position deviation amount of the chip with respect to the substrate is equal to or less than a position deviation amount threshold value.Type: ApplicationFiled: February 7, 2020Publication date: February 2, 2023Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Publication number: 20210320024Abstract: This substrate bonding device (100) includes: a stage (401), a head (402), an electrostatic chuck that holds a peripheral portion of a substrate (301) while the stage (401) supports the substrate (301), a holder driver that drives the electrostatic chuck, and a controller (700). The electrostatic chuck is disposed in a first area on the stage (401) facing the peripheral portion of the substrate (301), and the holder driver drives the electrostatic chuck by applying voltage to the electrostatic chuck. The controller (700) controls the holder driver in such a manner that a peripheral portion of the substrate (301) is released from the electrostatic chuck when a peripheral portion of the substrate (301) is made to come into contact with a peripheral portion of the substrate (302) while a central portion of a bonding surface of the substrate (301) and a central portion of a bonding surface of the substrate (302) are in contact with each other.Type: ApplicationFiled: July 2, 2019Publication date: October 14, 2021Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Publication number: 20210313211Abstract: This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices (35a, 35b). The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices (35a, 35b) and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.Type: ApplicationFiled: November 15, 2018Publication date: October 7, 2021Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Publication number: 20210265300Abstract: A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.Type: ApplicationFiled: November 14, 2018Publication date: August 26, 2021Applicants: BONDTECH CO., LTD.Inventors: Akira YAMAUCHI, Tadatomo SUGA
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Patent number: 10580752Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.Type: GrantFiled: October 19, 2015Date of Patent: March 3, 2020Assignee: BONDTECH CO., LTD.Inventor: Akira Yamauchi
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Publication number: 20200006099Abstract: A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (?Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (?Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).Type: ApplicationFiled: January 31, 2018Publication date: January 2, 2020Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Patent number: 10204785Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.Type: GrantFiled: November 13, 2017Date of Patent: February 12, 2019Assignees: BONDTECH CO., LTD.Inventors: Tadatomo Suga, Akira Yamauchi
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Patent number: 9870922Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).Type: GrantFiled: April 24, 2015Date of Patent: January 16, 2018Assignees: BONDTECH CO., LTD.Inventors: Tadatomo Suga, Akira Yamauchi
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Publication number: 20170221856Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain.Type: ApplicationFiled: October 19, 2015Publication date: August 3, 2017Applicant: BONDTECH CO., LTD.Inventor: Akira YAMAUCHI
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Patent number: 9601350Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.Type: GrantFiled: January 30, 2012Date of Patent: March 21, 2017Assignees: BONDTECH CO., LTD., TAIYO YUDEN CO., LTD., LAN TECHNICAL SERVICE CO., LTD.Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
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Patent number: 9379082Abstract: A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ?D between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ?D is corrected (step S17).Type: GrantFiled: October 27, 2015Date of Patent: June 28, 2016Assignee: Bondtech Co., Ltd.Inventor: Akira Yamauchi