Abstract: A fiber block for connecting optical fibers to an optical device comprises a lithographically defined front face and a plurality of recesses for optical fibers extending linearly from the front face in a plane which is substantially perpendicular to the front face, at an angle within that plane which is non-perpendicular to the front face. It is preferred that the block is essentially rectangular with recesses for the optical fiber formed in it in a non-perpendicular arrangement. The block is preferably formed as two mating parts each with aligned recesses on their mating faces, thereby to permit an optical fiber to be held in a pair of recesses one on each part. The recesses can end with a locally narrower portion which acts as an end stop for the fiber thereby to permit it to be located accurately. The recesses are preferably V-grooves and the block is preferably of silicon.

Abstract: A method of fabricating an integrated optical component on a silicon-on insulator chip comprising a silicon layer (1) separated from a substrate (2) by an insulating layer (3), the component having a first set of features, eg a rib waveguide (5) at a first level in the silicon layer (1) adjacent the insulating layer (3) and a second set of features, eg a triangular section (5B) at a second level in the silicon layer (1) further from the insulating layer (3), the method comprising the steps of: selecting a silicon-on-insulator chip having a silicon layer (1) of sufficient thickness for the first set of features; fabricating the first set of features in the silicon layer (1) at a first level in the silicon layer; increasing the thickness of the silicon layer (1) in selected areas to form a second level of the silicon layer (1) over part of the first level; and then fabricating the second set of features at the second level in the silicon layer (1).

Abstract: A method of forming an integrated chip optical device as a protective layer formed over part of the face of the chip on which at least one optical waveguide is formed, and the protective coating is selectively removed leaving the coating over an edge region 18 and the edge of the device is polished to provide high edge quality against which offchip optical fibers may be abutted.

Abstract: A system (10) comprises a carrier (1) which is adapted to carry an optical fiber (9) and an optical chip (3) having a circuit element (4). The carrier and the optical chip are provided with co-operable alignment features (13,14) for aligning the carrier with the optical chip so that the optical fiber and the circuit element are optically coupled.

Abstract: An optical chip (10;110) has a surface (3;103) with an edge (7;107), an optical component (5;105) disposed on the surface spaced from the edge and an optically conductive element (33;133) extending from the optical component to the edge through which the optical component is able to be optically coupled with an optical fiber (25).

Abstract: A device 102 incorporating a sensor 106 for sensing a temperature of the device and/or a local heater 106 for the provision of heat to a minority area within the device, wherein the sensor and/or the local heater comprises at least one semiconductor element 302,804 which is fabricated as part of the device.

Abstract: An optical interface arrangement includes a tile carrying an optical component which is mounted substantially at right angles to a closely adjacent circuit board which carries an electrical circuit. The circuit board has an electrically conductive track extending to an edge of the board adjacent to an edge of the tile. The edge surface of the tile has a localized recess carrying an electrically conductive material which extends across the thickness of the tile and along a major surface of the tile to connect with the optical component. A short bondwire is provided which links the electrically conductive material in the recess to the adjacent electrically conductive track on the circuit board.

Abstract: In one aspect of the invention there is provided a retainer (150) for retaining a first section of an elongate element (13) of generally curvilinear cross section in a mounting channel (18) which extends along a surface (24) of a first side of a substrate (23) from an edge (25) at which a second side (27) of the substrate inclines away from the first side in a first direction.

Abstract: An optical coupling between first and second optical components 1, 8 in which an input face 2A through which light is to pass of the first component 1 being directly bonded to an output face 8C through which light is to pass of the second component 8. Such a coupling may be provided, for example, between a rib waveguide 2 and an optical fibre 7.

Abstract: An optical waveguide structure formed on an optical chip comprising a first waveguide layer 3 of a first material supported on a substrate 7 and a second waveguide layer 6 of a second material supported on the first waveguide layer 3. The first waveguide layer 3 is separated from the substrate 7 by an optical confinement layer 8 and the second waveguide layer 6 is separated from the first waveguide layer 3 by an etch-stop layer 9. The etch-stop layer 9 is thin compared to the thickness of the first waveguide layer 3 and/or the second waveguide layer 6 and is of a material which enables it to act as an etch-stop when features are etched in the second waveguide layer 6.

Abstract: A rib waveguide structure comprising a layer (4) of light conductive material defined between two planar faces with a rib (9) formed on one of the faces and an optical components e.g. a tapered waveguide (6) optically coupled to the other face. An inverted rib waveguide comprising a light conductive layer (11) and a rib (10) that projects from the light conductive layer (11) into a substrate (4, 8) is also described as well as other optical devices comprising a light conductive layer separated from a substrate by a non-planar layer (3) of light confining material and optical devices comprising two or more layers (2, 3; 18, 19, 20) of light confining material buried within a rib with a light conducting component (10; 17; 22) at least a part of which is formed between planes defined by the two layers of light confining material. A method of forming such devices is also described.

Abstract: An isolation device that can be used for providing optical and electrical isolation between areas of an integrated chip. The isolation device includes three doped elongate regions which form diodes which can be connected in series. The isolation device can be used in optical devices or optical attenuators.

Abstract: An electro-optic device is disclosed for altering the density of charge carriers within an integrated optical waveguide. The device includes a substrate, and an integrated optical waveguide extending across the substrate with two doped regions being provided such that an electrical signal can be applied across the doped regions to alter the density of charge carriers within the waveguide. The doped regions can each include a plurality of doped areas spaced apart from each other along the length of the waveguide.

Abstract: An hermetically sealed fiber optic gyroscope assembly has loops of optic fiber on a support ring in a sealed casing comprising a base plate, a perimeter wall upstanding from the base plate and a cover secured to the perimeter of the wall, together with optical circuitry located within the casing for directing light around the optic fibre loops together with electrical connecting circuitry passing from the optical circuitry to external terminals in sealed engagement with the casing.

Abstract: The optical component (4) is mounted on an optical chip in alignment with an optical fibre (1) which is mounted within a V-groove (2) formed in the chip, the optical component (4) has two non-parallel location surfaces (4A, 4B) which abut against corresponding location features (5, 6) on the chip to locate the component (4) in a first direction (Y-axis) substantially perpendicular to the plane of the chip and in a second direction (Z-axis) which is perpendicular to said first direction (Y-axis) and substantially perpendicular to the length (X-axis) of the V-groove (2), and the optical component (4) is mounted on the chip so as to overhang one end (2A) of the V-groove to enable the end (1A) of the optical fibre (1) to be brought into a close, abutting relationship with the component (4).

Abstract: The invention provides a method of generating an alignment feature (200, 300) in an optoelectronic assembly (10, 700) which enables another part, for example an optical fibre (80), external to the assembly to be aligned to a device (40, 400) within the assembly (10, 700) but without needing to be attached to the device (40, 400). The method involves using the device (40, 400) to define a position for its own alignment feature to which the part can register, thereby aligning the part (80) to the device (40, 400). When the device (40) is an emissive device, radiation emitted therefrom is used to delineate a position for the alignment feature. When the device (400) is a detecting device, the feature is defined with assistance of an apparatus (500) whose beam is guided in response to output from the device (400) to delineate a position for the alignment feature.

Abstract: An optical circuit device (1; 1′) has a substrate (6; 5′) with a surface (7; 7′) and a structural discontinuity (17; 17′) in the surface. The surface is provided with a light source (13: 13′) to emit light and a circuit element (15; 15′) whose performance is adversely affected by the incidence thereon of stray light emifted by the light source. To reduce optical cross-talk, the optical circuit device is provided with a barrier element (21; 21′) which is adapted to absorb light emitted by the light source. The barrier element is located in the structural discontinuity and is so positioned as to be able to absorb stray light embted by the light source The optical circuit device may be an optical transceiver having a laser diode and a photodiods.

Abstract: An integrated optical circuit is formed in a silicon layer and supported on a substrate, and a portion of the silicon layer is substantially thermally isolated from the substrate by extending over a recess in the substrate, e.g. in the form of a bridge. Temperature control means are provided to control the temperature of the portion of the silicon layer or of a device provided thereon. A thermal expansion gap may be provided in the portion to accommodate thermal expansion of the portion relative to the substrate.

Abstract: A method of providing a point to point connection between two electrical circuit boards (23, 23′) in which a plurality of pairs of optical transceivers are provided, one transceiver of each pair being formed on a first silicon-on-insulator chip (2) in electrical contact with a first electrical circuit board (23), and the other transceiver of each pair being formed on a second silicon-on-insulator chip (2′) in electrical contact with a second electrical circuit board (23′). Each optical transceiver comprises a branched rib waveguide comprising a common stem (10, 26) and first and second branches (14, 12) extending from the common stem (10, 26); a fiber connector (20) for receiving an optical fiber (22) in communication with the stem (10, 26) of the branched rib waveguide; a light source (4) in communication with the first branch (14) of the branched rib waveguide; and a light receiver (6) in communication with the second branch (12) of the branched rib waveguide.

Abstract: An integrated optical package comprises an integrated optical device in a substantially planar form and a supporting structure, the device being held by the supporting structure in a plurality of fixing regions, the fixing regions being elongate and serving to secure the device in each of the two dimensions of the planar form, at least one edge of the planar form being unfixed. Thus, either two or three edges of the planar form are unfixed, assuming that the device is rectangular. This ensures that one or two edges are free, allowing the device to accommodate stresses by slight relaxation. The device can be held by a heat curable composition, ideally adapted to cure at about the operating temperature of the device. Thus, when the device is operating, the adhesive is substantially at or near its cure temperature. The composition should cure at a temperature within 20° C. of the operating temperature of the device.