Abstract: A rotor core molding system, for molding magnets in an unmolded rotor core to provide a molded rotor core for an electrical motor, comprises first and second molds arranged to allow clamping at least one unmolded rotor core between the molds, a pre-adjustment arrangement for allowing to pre-adjust a distance between the molds in a preset open configuration of the molds to a pre-adjusted distance, and a mold closure arrangement for allowing to close the molds from the preset open configuration to a closed configuration by moving the molds towards one another to clamp unmolded rotor core(s) provided between the molds with a predetermined pressure in between the molds in the closed configuration. The pre-adjustment arrangement is configured to provide a relatively long-range distance movement, especially corresponding to one or more rotor core heights. The mold closure arrangement is configured to provide a relatively short-range distance movement.

Abstract: A rotor core manufacturing method and system allow for molding permanent magnets in an unmolded rotor core to provide an electric motor molded rotor core. The unmolded rotor core includes a shaft and rotor core body having a central through-hole along a longitudinal axis, magnet cavities around the axis with magnets therein. The shaft lies in the central through-hole and projects therefrom, and the molded rotor core includes the rotor core body having the magnets fixed in the cavities. The method includes inserting an unmolded rotor core between the first and second molds of a rotor core molding system; moving the molds together to clamp the rotor core body of the unmolded rotor core with a predetermined pressure; providing a molding material into the magnet cavities; letting the molding material cure within the magnet cavities to a molded rotor core; opening the molds and removing the molded rotor core.

Abstract: A component processing apparatus defines at least one component holding position for holding a component, such as comprising a semiconductor die, a substrate, a cooling plate, a package, an inverter casing, a spacer, etcetera, and comprises at least one displaceable member associated with each component holding position. Each displaceable member is configured and arranged to allow exerting force on a component held in the associated component holding position. The component processing apparatus comprises at least one apparatus part that is susceptible to strain induced by force, in use, exerted by the at least one displaceable member on the respective component(s) held in the component holding position(s), and that has a Fiber Bragg Grating, FBG, strain sensor.

Abstract: A method of closing a mold and a press therefore, whereby a first mold part is moved towards a second mold part by a first relatively large displacement via a mechanical non-fluid drive. The mold parts are then pressed against one another by a fluid system including a pneumatically driven hydraulic system to provide relative high mold pressures. Drive and follower pins are selectively coupled to the hydraulic system by a carousel for selectively coupling a mold part to the hydraulic system during the pressing portion of the cycle. The method and press are particularly suitable for encapsulating electrical components.

Abstract: A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.