Patents Assigned to Bostik Findley
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Patent number: 8034405Abstract: The invention relates to a method for coating a substrate with a fluid. This method comprises the steps: (i) of supply of a substrate and of a yield point fluid; and (ii) of shearing of the fluid and of application of the fluid to the substrate, the fluid supplied comprising a solvent-free reactive polyurethane mixture.Type: GrantFiled: July 13, 2009Date of Patent: October 11, 2011Assignee: Bostik Findley S.A.Inventors: Michel Miskovic, Jean-Francois Chartrel
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Patent number: 7749571Abstract: The invention relates to a coating device (10) comprising a coating tank (21) with an opening (22) and a coating roll (31), in which the roll (31) faces the opening (22). A further subject of the invention is a method for coating a substrate with a fluid comprising the steps of (i) supply of a substrate (40) and of a fluid, (ii) application of the fluid to the substrate (40) and (iii) shearing of the fluid by the substrate (40) set in motion in relation to the fluid.Type: GrantFiled: July 1, 2004Date of Patent: July 6, 2010Assignee: Bostik Findley S.A.Inventor: Jean-Francois Chartrel
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Publication number: 20080141629Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.Type: ApplicationFiled: December 14, 2007Publication date: June 19, 2008Applicant: Bostik Findley, Inc.Inventors: Mark Alper, Atul Mehta
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Patent number: 7326042Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.Type: GrantFiled: December 24, 2002Date of Patent: February 5, 2008Assignee: Bostik Findley, Inc.Inventors: Mark Alper, Atul Mehta
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Patent number: 7262251Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-?-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.Type: GrantFiled: October 27, 2003Date of Patent: August 28, 2007Assignee: Bostik Findley, Inc.Inventors: Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes, Baoyu Wang
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Patent number: 7235152Abstract: A storage stable adhesive paste composition is described. It contains a plurality of first solid particles comprising a surface protected polyisocyanate and a plurality of second solid particles of polymer having functional groups that react with the polyisocyanate. The particles may be protected by encapsulation in a layer of a material that is not reactive to the polyisocyanate. Preferably, the protective layer also is not reactive to the polymer having functional groups that react with the polyisocyanate. The polyisocyanate particles also can be protected by a layer formed by chemically reacting said polyisocyanate particles with isocyanate reactive compounds to form a protective surface layer around said polyisocyanate particles.Type: GrantFiled: May 13, 2003Date of Patent: June 26, 2007Assignee: Bostik-Findley LimitedInventors: Jeremy Bell, Andrew Crabtree
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Patent number: 7195692Abstract: The invention relates to a moisture-crosslinkable polyurethane adhesive which comprises: a) 70 to 95% by weight of a polyurethane prepolymer obtained by polyaddition of polyols to diisocyanates trimerized as isocyanurates and, b) 5 to 30% by weight of an essentially amorphous poly-a-olefin, the content of free NCO groups representing 1 to 20% by weight of the adhesive. The adhesive according to the invention is used for the adhesive bonding of fixing components of the Velcro type to articles intended for hygiene.Type: GrantFiled: March 24, 2003Date of Patent: March 27, 2007Assignee: Bostik FindleyInventors: Michel Miskovic, François Bauduin, Patrick Bouttefort, Jean-François Chartrel
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Publication number: 20050059759Abstract: The invention relates to a method of gluing substrates which are hydrophobic and oleophobic as a result of having been treated earlier using a fluorinated compound, said substrates being intended for packaging. The inventive method consists in applying an adhesive to at least one of the substrates, said adhesive comprising: a) 5 to 50 weight percent of at least one styrenic block copolymer (preferably, 15 to 30%); b) 20 to 60 weight percent of at least one tackifying resin which is compatible with the non-styrene phase (preferably, 35 to 55%); c) 0 to 20 weight percent of at least one tackifying resin which is compatible with the styrene phase and, (preferably, 5 to 15%); d) 5 to 25 weight percent of at least one thermofusible wax (preferably, 10 to 17%); e) 3 to 20 weight percent of liquid plasticisers which are normally used in thermofusible adhesives; and/or f) additives. In this way, said mixture presents the following characteristics: (i) a viscosity of between 400 and 3000 mPa.s at 170° C.Type: ApplicationFiled: April 2, 2004Publication date: March 17, 2005Applicant: BOSTIK FINDLEY S.A.Inventors: Nicolas Sajot, Benoit Pollacchi, Saida Sellak
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Patent number: 6860961Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.Type: GrantFiled: April 29, 2002Date of Patent: March 1, 2005Assignee: Bostik Findley, Inc.Inventors: Mark Gibes, Diane Strelow, Mark Alper
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Publication number: 20040077759Abstract: The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called “repositionable” packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.Type: ApplicationFiled: December 10, 2003Publication date: April 22, 2004Applicant: Bostik Findley, S.A.Inventors: Anne Bardiot, Nicolas Sajot, Pierre Gerard, Christophe Notteau
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Patent number: 6664309Abstract: Hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a bacteriostat. The bacteriostat is incorporated into the adhesive compositions in sufficient amounts to inhibit the growth of various microorganisms, particularly bacteria. The preferred bacteriostat is triclosan in amounts of 0.01% to 5% by weight.Type: GrantFiled: December 7, 2000Date of Patent: December 16, 2003Assignee: Bostik Findley, Inc.Inventors: Lacretia Svenningsen, Diane Strelow, Mark Alper, Marihelen Hoppa-Willbrandt
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Patent number: 6653385Abstract: A hot melt adhesive composition based on a polymer blend of syndiotactic polypropylene (SPP) and atactic poly-&agr;-olefin (APAO). The composition contains about 15%-80% by weight of the SPP/APAO blend, about 15%-65% by weight of a compatible tackifier, about 0%-35% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, and optionally, about 0%-30% by weight of a wax. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.Type: GrantFiled: October 18, 2001Date of Patent: November 25, 2003Assignee: Bostik Findley, Inc.Inventors: Baoyu Wang, Chongyao Zhang
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Patent number: 6491776Abstract: The present invention provides a method of making a laminated, gathered, elastic web. The method includes the steps of feeding a first substrate in a machine direction, feeding a second substrate aligned with the first substrate in the machine direction, and feeding an array of elastomeric strand material between the first and second substrates in such a manner that the elastomeric strand material is stretched in the machine direction and aligned with the first and second substrates. A hot melt pressure sensitive adhesive, such as a styrene-isoprene-styrene based adhesive, is applied to one substrate, and a curable adhesive, such as a polyurethane based adhesive, is applied to the other substrate. Thereafter, the two substrates and the elastomeric strand material are compressed to form a laminate elastic web while maintaining the elastomeric strand material in its stretched state. Machine direction tension is maintained on the laminate until the hot melt adhesive cools and bonds the layers together.Type: GrantFiled: April 23, 2001Date of Patent: December 10, 2002Assignee: Bostik Findley, Inc.Inventors: Mark Alper, Russell P. Stuczynski
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Publication number: 20020161085Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 750 of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.Type: ApplicationFiled: April 29, 2002Publication date: October 31, 2002Applicant: Bostik Findley, Inc.Inventors: Mark Gibes, Diane Strelow, Mark Alper
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Patent number: 6380292Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by (blending various adhesive components with a surfactant.) The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.Type: GrantFiled: June 21, 1996Date of Patent: April 30, 2002Assignee: Bostik Findley, Inc.Inventors: Mark Gibes, Diane Strelow, Mark Alper
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Patent number: 6355760Abstract: The invention relates to polyurethane having improved shear strength which are obtained by polycondensation of a mixture of at least one polyol containing one or more polyether grafts and at least one short-chain alcohol with at least one diisocyanate. The invention also relates to the polyurethanes which are in the form of strips whose thickness is between 0.1 and 10 mm. The invention also relates to articles comprising the said polyurethanes.Type: GrantFiled: September 11, 2000Date of Patent: March 12, 2002Assignee: Bostik FindleyInventors: Eric Papon, Jean-Jacques Villenave, Philippe Tordjeman
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Patent number: 6329468Abstract: A flexible polyolefin-based hot melt adhesive composition having a variety of end uses, particularly in bonding polyethylene and polypropylene films, nonwoven fabrics and elastic attachment applications in nonwoven disposable articles. The composition includes a flexible polyolefin polymer or a blend of flexible polyolefin polymers, a tackifier resin, a plasticizer, and optionally a wax and a stabilizer. The preferred flexible polyolefin polymer has a melt flow rate greater than 5 g/10 min. and a density between 0.86 to 0.90 g/cm3. The hot melt adhesive composition provides a novel combination of desirable properties including good adhesion to a variety of substrates, low viscosity, good heat stability and oil resistance. The adhesive can be applied using common application techniques such as extruding or spraying.Type: GrantFiled: January 21, 2000Date of Patent: December 11, 2001Assignee: Bostik Findley, Inc.Inventor: Baoyu Wang
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Patent number: 6291562Abstract: A water sensitive hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 5% to about 95%, by weight, of a poly [vinyl methyl ether]; about 5% to about 70%, by weight, of a tackifying resin; and about 5% to about 35%, by weight, of a water soluble plasticizer.Type: GrantFiled: March 19, 1996Date of Patent: September 18, 2001Assignee: Bostik Findley, Inc.Inventor: John A. Kreuser