Patents Assigned to Bostik Findley, Inc.
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Publication number: 20080141629Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.Type: ApplicationFiled: December 14, 2007Publication date: June 19, 2008Applicant: Bostik Findley, Inc.Inventors: Mark Alper, Atul Mehta
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Patent number: 7326042Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.Type: GrantFiled: December 24, 2002Date of Patent: February 5, 2008Assignee: Bostik Findley, Inc.Inventors: Mark Alper, Atul Mehta
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Patent number: 7262251Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-?-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.Type: GrantFiled: October 27, 2003Date of Patent: August 28, 2007Assignee: Bostik Findley, Inc.Inventors: Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes, Baoyu Wang
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Patent number: 6860961Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.Type: GrantFiled: April 29, 2002Date of Patent: March 1, 2005Assignee: Bostik Findley, Inc.Inventors: Mark Gibes, Diane Strelow, Mark Alper
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Patent number: 6664309Abstract: Hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a bacteriostat. The bacteriostat is incorporated into the adhesive compositions in sufficient amounts to inhibit the growth of various microorganisms, particularly bacteria. The preferred bacteriostat is triclosan in amounts of 0.01% to 5% by weight.Type: GrantFiled: December 7, 2000Date of Patent: December 16, 2003Assignee: Bostik Findley, Inc.Inventors: Lacretia Svenningsen, Diane Strelow, Mark Alper, Marihelen Hoppa-Willbrandt
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Patent number: 6653385Abstract: A hot melt adhesive composition based on a polymer blend of syndiotactic polypropylene (SPP) and atactic poly-&agr;-olefin (APAO). The composition contains about 15%-80% by weight of the SPP/APAO blend, about 15%-65% by weight of a compatible tackifier, about 0%-35% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, and optionally, about 0%-30% by weight of a wax. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.Type: GrantFiled: October 18, 2001Date of Patent: November 25, 2003Assignee: Bostik Findley, Inc.Inventors: Baoyu Wang, Chongyao Zhang
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Patent number: 6491776Abstract: The present invention provides a method of making a laminated, gathered, elastic web. The method includes the steps of feeding a first substrate in a machine direction, feeding a second substrate aligned with the first substrate in the machine direction, and feeding an array of elastomeric strand material between the first and second substrates in such a manner that the elastomeric strand material is stretched in the machine direction and aligned with the first and second substrates. A hot melt pressure sensitive adhesive, such as a styrene-isoprene-styrene based adhesive, is applied to one substrate, and a curable adhesive, such as a polyurethane based adhesive, is applied to the other substrate. Thereafter, the two substrates and the elastomeric strand material are compressed to form a laminate elastic web while maintaining the elastomeric strand material in its stretched state. Machine direction tension is maintained on the laminate until the hot melt adhesive cools and bonds the layers together.Type: GrantFiled: April 23, 2001Date of Patent: December 10, 2002Assignee: Bostik Findley, Inc.Inventors: Mark Alper, Russell P. Stuczynski
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Publication number: 20020161085Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 750 of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.Type: ApplicationFiled: April 29, 2002Publication date: October 31, 2002Applicant: Bostik Findley, Inc.Inventors: Mark Gibes, Diane Strelow, Mark Alper
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Patent number: 6380292Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by (blending various adhesive components with a surfactant.) The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.Type: GrantFiled: June 21, 1996Date of Patent: April 30, 2002Assignee: Bostik Findley, Inc.Inventors: Mark Gibes, Diane Strelow, Mark Alper
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Patent number: 6329468Abstract: A flexible polyolefin-based hot melt adhesive composition having a variety of end uses, particularly in bonding polyethylene and polypropylene films, nonwoven fabrics and elastic attachment applications in nonwoven disposable articles. The composition includes a flexible polyolefin polymer or a blend of flexible polyolefin polymers, a tackifier resin, a plasticizer, and optionally a wax and a stabilizer. The preferred flexible polyolefin polymer has a melt flow rate greater than 5 g/10 min. and a density between 0.86 to 0.90 g/cm3. The hot melt adhesive composition provides a novel combination of desirable properties including good adhesion to a variety of substrates, low viscosity, good heat stability and oil resistance. The adhesive can be applied using common application techniques such as extruding or spraying.Type: GrantFiled: January 21, 2000Date of Patent: December 11, 2001Assignee: Bostik Findley, Inc.Inventor: Baoyu Wang
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Patent number: 6291562Abstract: A water sensitive hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 5% to about 95%, by weight, of a poly [vinyl methyl ether]; about 5% to about 70%, by weight, of a tackifying resin; and about 5% to about 35%, by weight, of a water soluble plasticizer.Type: GrantFiled: March 19, 1996Date of Patent: September 18, 2001Assignee: Bostik Findley, Inc.Inventor: John A. Kreuser