Patents Assigned to Bostik Findley, Inc.
  • Publication number: 20080141629
    Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 19, 2008
    Applicant: Bostik Findley, Inc.
    Inventors: Mark Alper, Atul Mehta
  • Patent number: 7326042
    Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.
    Type: Grant
    Filed: December 24, 2002
    Date of Patent: February 5, 2008
    Assignee: Bostik Findley, Inc.
    Inventors: Mark Alper, Atul Mehta
  • Patent number: 7262251
    Abstract: A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%-50% by weight of the RCP copolymer, about 20%-65% by weight of a compatible tackifier, about 0%-40% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, about 0%-40% by weight of a wax, about 0%-60% by weight of an atactic poly-?-olefin (APAO), and about 0%-40% by weight of a secondary polymer. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: August 28, 2007
    Assignee: Bostik Findley, Inc.
    Inventors: Monina Dadap Kanderski, Lacretia A. Svenningsen, Diane M. Strelow, Chongyao Zhang, Mark A. Gibes, Baoyu Wang
  • Patent number: 6860961
    Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: March 1, 2005
    Assignee: Bostik Findley, Inc.
    Inventors: Mark Gibes, Diane Strelow, Mark Alper
  • Patent number: 6664309
    Abstract: Hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a bacteriostat. The bacteriostat is incorporated into the adhesive compositions in sufficient amounts to inhibit the growth of various microorganisms, particularly bacteria. The preferred bacteriostat is triclosan in amounts of 0.01% to 5% by weight.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: December 16, 2003
    Assignee: Bostik Findley, Inc.
    Inventors: Lacretia Svenningsen, Diane Strelow, Mark Alper, Marihelen Hoppa-Willbrandt
  • Patent number: 6653385
    Abstract: A hot melt adhesive composition based on a polymer blend of syndiotactic polypropylene (SPP) and atactic poly-&agr;-olefin (APAO). The composition contains about 15%-80% by weight of the SPP/APAO blend, about 15%-65% by weight of a compatible tackifier, about 0%-35% by weight of a plasticizer, about 0%-3% by weight of a stabilizer, and optionally, about 0%-30% by weight of a wax. The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: November 25, 2003
    Assignee: Bostik Findley, Inc.
    Inventors: Baoyu Wang, Chongyao Zhang
  • Patent number: 6491776
    Abstract: The present invention provides a method of making a laminated, gathered, elastic web. The method includes the steps of feeding a first substrate in a machine direction, feeding a second substrate aligned with the first substrate in the machine direction, and feeding an array of elastomeric strand material between the first and second substrates in such a manner that the elastomeric strand material is stretched in the machine direction and aligned with the first and second substrates. A hot melt pressure sensitive adhesive, such as a styrene-isoprene-styrene based adhesive, is applied to one substrate, and a curable adhesive, such as a polyurethane based adhesive, is applied to the other substrate. Thereafter, the two substrates and the elastomeric strand material are compressed to form a laminate elastic web while maintaining the elastomeric strand material in its stretched state. Machine direction tension is maintained on the laminate until the hot melt adhesive cools and bonds the layers together.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: December 10, 2002
    Assignee: Bostik Findley, Inc.
    Inventors: Mark Alper, Russell P. Stuczynski
  • Publication number: 20020161085
    Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 750 of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 31, 2002
    Applicant: Bostik Findley, Inc.
    Inventors: Mark Gibes, Diane Strelow, Mark Alper
  • Patent number: 6380292
    Abstract: Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by (blending various adhesive components with a surfactant.) The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: April 30, 2002
    Assignee: Bostik Findley, Inc.
    Inventors: Mark Gibes, Diane Strelow, Mark Alper
  • Patent number: 6329468
    Abstract: A flexible polyolefin-based hot melt adhesive composition having a variety of end uses, particularly in bonding polyethylene and polypropylene films, nonwoven fabrics and elastic attachment applications in nonwoven disposable articles. The composition includes a flexible polyolefin polymer or a blend of flexible polyolefin polymers, a tackifier resin, a plasticizer, and optionally a wax and a stabilizer. The preferred flexible polyolefin polymer has a melt flow rate greater than 5 g/10 min. and a density between 0.86 to 0.90 g/cm3. The hot melt adhesive composition provides a novel combination of desirable properties including good adhesion to a variety of substrates, low viscosity, good heat stability and oil resistance. The adhesive can be applied using common application techniques such as extruding or spraying.
    Type: Grant
    Filed: January 21, 2000
    Date of Patent: December 11, 2001
    Assignee: Bostik Findley, Inc.
    Inventor: Baoyu Wang
  • Patent number: 6291562
    Abstract: A water sensitive hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 5% to about 95%, by weight, of a poly [vinyl methyl ether]; about 5% to about 70%, by weight, of a tackifying resin; and about 5% to about 35%, by weight, of a water soluble plasticizer.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: September 18, 2001
    Assignee: Bostik Findley, Inc.
    Inventor: John A. Kreuser