Abstract: A system for the flux free processing of a plurality of solder balls on a wafer, comprising: an articulable vacuum support chuck for maintaining support of a plurality of solder balls on a wafer being processed. An articulable flux-free binder applicator arranged in binder depositing relationship with the wafer within the treatment chamber. An articulable fluid dispenser is arranged in a binder-applied minimization-treatment with respect to the flux free binder applied to the wafer within the treatment chamber.

Abstract: A vertically oriented treatment chamber for the processing of a flux-free solder ball (or plated solder ball) loaded wafer chip. A treatment chamber comprises a first or upper heater at an upper end of the treatment chamber and a second or lower heater at a lower end of the treatment chamber. The treatment chamber includes a centrally disposed, preloaded flux free solder ball loaded wafer chip support ring movable upwardly and downwardly within the treatment chamber in response to temperature sensed monitoring of a wafer chip supported on the wafer chip support ring.