Patents Assigned to BotFactory Inc.
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Patent number: 11871520Abstract: A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.Type: GrantFiled: August 17, 2020Date of Patent: January 9, 2024Assignee: BOTFACTORY INC.Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
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Patent number: 11596071Abstract: An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.Type: GrantFiled: January 27, 2020Date of Patent: February 28, 2023Assignee: BOTFACTORY INC.Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
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Publication number: 20200383250Abstract: A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.Type: ApplicationFiled: August 17, 2020Publication date: December 3, 2020Applicant: BOTFACTORY INC.Inventors: Michael KNOX, Andrew IPPOLITI, Georgios KYRIAKOU, Carlos OSPINA, Nicolas VANSNICK
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Patent number: 10779451Abstract: An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.Type: GrantFiled: December 1, 2014Date of Patent: September 15, 2020Assignee: BotFactory, Inc.Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
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Publication number: 20200163220Abstract: An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.Type: ApplicationFiled: January 27, 2020Publication date: May 21, 2020Applicant: BOTFACTORY INC.Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
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Patent number: 10548231Abstract: An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. Conductive traces having varying thickness may be produced on a common substrate. Conductive regions are printed to electrically isolate traces and optional to present an approximately level surface.Type: GrantFiled: June 6, 2016Date of Patent: January 28, 2020Assignee: BotFactory Inc.Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick