Abstract: There is provided a light emitting device, for example a grow-light, comprising: a first solid-state light source that generates blue light with a blue photon flux; and a second solid-state light source that generates red light with a red photon flux; wherein a ratio of the blue photon flux to red photon flux is from about 1:3 to about 3:1. It may be that the broadband blue light substantially matches at least one of: the absorption peak wavelength of chlorophyll-a; the absorption peak wavelength of chlorophyll-b; and the absorption peak wavelength of carotenoid.

Abstract: A full spectrum light emitting device includes photoluminescence materials which generate light with a peak emission wavelength in a range 490 nm to 680 nm (green to red) and a broadband solid-state excitation source operable to generate broadband blue excitation light with a dominant wavelength in a range from 420 nm to 470 nm, where the broadband blue excitation light includes at least two different blue light emissions in a wavelength range 420 nm to 480 nm.

Abstract: An exemplary method of manufacturing a white light emitting device may include providing first LEDs and second LEDs operable to generate excitation light having a dominant wavelength in a range from 440 nm to 480 nm; providing a first photoluminescence material which generates light having a peak emission wavelength in a range from 500 nm to 590 nm; providing a second photoluminescence material which generates light having a peak emission wavelength in a range from 600 nm to 650 nm; disposing the second photoluminescence material over and into direct contact with the second LED; and disposing the first photoluminescence material over the first and second LEDs.

Abstract: A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.

Abstract: A light-emitting device and a method for manufacturing the light-emitting device is disclosed. Such a light-emitting device comprises a substrate, a plurality of cells disposed on the substrate, and a plurality of semiconductor dice, wherein each of the plurality of cells accommodates at least one of the plurality of dice. Each of the plurality of cells may be filled with an encapsulant, phosphor or a mixture of an encapsulant with phosphor to control light characteristics of the light-emitting device. In an alternative aspect, cells may be filled with an encapsulant, and comprise a transparent cover coated with or filled with phosphors to control light characteristics of the light-emitting device.

Abstract: A lighting device comprising: a first LED having a wavelength of maximum emission intensity from 620 nm to 640 nm; a second LED having a wavelength of maximum emission intensity from 500 nm to 565 nm; a third LED having a wavelength of maximum emission intensity from 430 nm to 480 nm; and a fourth LED for generating light comprising a CCT in a range from 1800K to 5000K. The first LED comprises a Phosphor-Converted LED comprising a first LED chip having a maximum emission intensity wavelength from 400 nm to 480 nm, and a narrowband red phosphor with a FWHM less than 55 nm. Light generated by the device comprises a combination of light generated by the first, second, third, and fourth LEDs and a CCT of light generated by the device is tunable by independently controlling power to the first, second, third, and fourth LEDs.

Abstract: Side light LED troffer tube. In an aspect, a side light LED tube is provided that includes a tube having at least one light receiving portion configured to receive light and gradient optics formed on the tube. The gradient optics providing a transparency gradient configured to distribute the light to achieve a selected emitted light intensity variation across a selected surface of the tube.

Abstract: An LED-filament comprising: a partially light transmissive substrate; a plurality of LED chips on a front face of the substrate; a photoluminescence material that is in direct contact with and covers all of the plurality of LED chips; and a light scattering layer that is in direct contact with and covers at least the photoluminescence material, wherein the light scattering layer comprises particles of light scattering material, and wherein the photoluminescence material comprises broadband green to red photoluminescence materials and narrowband red photoluminescence material.

Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

Abstract: A white light emitting device may include a substrate, first LEDs disposed on the substrate, a first photoluminescence material disposed over the first LEDs, second LEDs disposed on the substrate, where the first LEDs and the second LEDs emit blue light at substantially the same wavelength, a second photoluminescence material disposed over the second LEDs, the second photoluminescence material having a composition different from the first photoluminescence material, where an emission product of the white light emitting device is a combination of light emitted from (i) a combination of the first LEDs and the first photoluminescence material, and (ii) a combination of the second LEDs and the second photoluminescence material, and a dimming control connected to the first LEDs and to the second LEDs; where the dimming control is actuable to modify the emission product.

Abstract: Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

Abstract: A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.

Abstract: Some embodiments of the disclosure provide for a lighting system including a substrate. The lighting system includes several blue light emitting diodes (LEDs) supported by the substrate. The lighting system includes at least one red LED supported by the substrate. The lighting system includes a light conversion material covering the blue LEDs and the at least one red LED.

Abstract: A method of controlling an LED system with a control signal having a first control scheme may include providing a lighting module including a control module, an LED driver connected to the control module, and at least one LED connected to the LED driver; receiving, at the control module, the control signal having a first control scheme; comparing the first control scheme to a predetermined second control scheme; when the comparing determines that the first control scheme is the same as the predetermined second control scheme, transmitting to the LED driver a driver control signal including the predetermined second control scheme; and when the comparing determines that the first control scheme is different from the predetermined second control scheme, translating, with the control module, the first control scheme into the predetermined second control scheme and then transmitting to the LED driver a driver control signal including the predetermined second control scheme.

Abstract: A lighting system that is part of a headlight module of a motor vehicle includes an array of LED light sources that include no organic materials. Each light source includes a glass lens attached to a phosphor glass converter plate, which itself is attached to an LED die that is flip-chip mounted on a mounting substrate. The converter plate includes phosphor particles embedded in glass. Each lens is disposed laterally over a single LED die. The converter plate is attached to the LED die by a first bonding layer, and the lens is attached to the converter plate by a second bonding layer. Both bonding layers are made of a metal oxide and are thinner than the converter plate. Either each lens does not extend horizontally outside the lateral boundary of each converter plate, or the lens portions centered on each LED die are part of a unitary lens array.

Abstract: Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

Abstract: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.

Abstract: Apparatus providing beamforming and environmental protection for LED light sources. A lens apparatus is provided to protect an LED mounted on a substrate. The lens apparatus includes an alignment feature configured to align the LED to a selected position and a focusing region configured to form a selected beam pattern from light emitted from the LED when located at the selected position. The lens apparatus also includes a compression surface configured to compress the substrate to a heat sink to facilitate heat dissipation from the LED and a fastening feature configured to fasten the lens apparatus to the heat sink to provide an environmentally protective seal, so that when the lens apparatus is fastened to the heat sink the alignment feature aligns the LED to the selected position, the compression surface compresses the substrate to the heat sink, and the protective seal protects the LED from environmental conditions.

Abstract: Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.

Abstract: A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.