Patents Assigned to Bridgelux, Inc
  • Patent number: 10714533
    Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 14, 2020
    Assignee: BRIDGELUX INC.
    Inventors: Mike Kwon, Gerry Keller, Scott West, Tao Tong, Babak Imangholi
  • Patent number: 10711960
    Abstract: Side light LED troffer tube. In an aspect, a side light LED tube is provided that includes a tube having at least one light receiving portion configured to receive light and gradient optics formed on the tube. The gradient optics providing a transparency gradient configured to distribute the light to achieve a selected emitted light intensity variation across a selected surface of the tube.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 14, 2020
    Assignee: BRIDGELUX INC.
    Inventor: Todd Farmer
  • Patent number: 10711957
    Abstract: Various aspects of a light emitting apparatus include a substrate having at least one angled portion. Some aspects of the light emitting apparatus include at least one light emitting device arranged on the substrate. Some aspects of the light emitting apparatus include a plurality of conductors arranged on the substrate. In some aspects of the light emitting apparatus, the conductors are electrically coupled to the at least one light emitting device.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 14, 2020
    Assignee: BRIDGELUX INC.
    Inventor: Vladimir Odnoblyudov
  • Patent number: 10663142
    Abstract: A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: May 26, 2020
    Assignee: BRIDGELUX INC.
    Inventors: Jesus Del Castillo, Scott West, Vladimir Odnoblyudov
  • Patent number: 10648644
    Abstract: A cover for a light source for use in a lamp or luminaire. An outer surface of the cover, opposite the light source, comprises a rounded shape and includes a protrusion extending from the cover. The protrusion extends substantially in a light emission direction and is shaped the protrusion to direct light emitted from the light source in a desired direction.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: May 12, 2020
    Assignee: BRIDGELUX INC.
    Inventor: Xiaolu Chen
  • Patent number: 10559731
    Abstract: Aspects include features for improving the reliability of a reflective base structure for light emitting diodes (LED) chip-on-board (COB) array products. The reflective base structure reduces reflective material of a reflective layer (e.g., silver) from migrating into adjacent layers. In one configuration used to reduce the migration of reflective material, a reflective base for a light-emitting diode (LED) may comprise a substrate, a reflective layer, and a diffusion barrier layer between the substrate and the reflective layer. In another configuration used to reduce the migration of reflective material, a reflective base for an LED comprising: a substrate, a reflective layer; and a planarizing layer between the substrate and the reflective layer, a thickness of the planarizing layer between the substrate and the reflective layer being less than 70 nm.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: February 11, 2020
    Assignee: BRIDGELUX INC.
    Inventors: Phil Elizondo, Joseph Leigh, Brian Cumpston
  • Patent number: 10551008
    Abstract: A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: February 4, 2020
    Assignee: BRIDGELUX INC.
    Inventors: Ghulam Hasnain, Calvin B. Ward
  • Patent number: 10495285
    Abstract: A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: December 3, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Xiaolu Chen, Wenhui Zhang, Scott West
  • Patent number: 10461064
    Abstract: Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: October 29, 2019
    Assignee: Bridgelux, Inc.
    Inventor: Vladimir A. Odnoblyudov
  • Patent number: 10403607
    Abstract: Some embodiments of the disclosure provide for a lighting system including a substrate. The lighting system includes several blue light emitting diodes (LEDs) supported by the substrate. The lighting system includes at least one red LED supported by the substrate. The lighting system includes a light conversion material covering the blue LEDs and the at least one red LED.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: September 3, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Vladimir Odnoblyudov, Cem Basceri, Peng Chen
  • Patent number: 10381333
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 13, 2019
    Assignee: Bridgelux, Inc.
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan
  • Publication number: 20190237640
    Abstract: An optical device capable of generating warm light using an array of phosphor islands situated over a phosphor layer is disclosed. The device includes a solid state light emitter, a phosphor layer, and phosphor islands. The solid state light emitter, in an aspect, is a light emitting diode (“LED”) capable of converting electrical energy to optical light. The phosphor layer is disposed over the solid state light emitter for generating luminous cool light in response to the optical light. Multiple phosphor islands are disposed on the phosphor layer for converting cool light to warm light, wherein the phosphor islands are evenly distributed over the phosphor layer.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 1, 2019
    Applicant: Bridgelux, Inc.
    Inventors: Tao Xu, Rene Peter Helbing
  • Patent number: 10364975
    Abstract: A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: July 30, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Alexander Rizkin, Robert Tudhope, Vahid Moshtagh, Hannu Tapani Hukkanen, Tomi Mikael Kuntze
  • Patent number: 10347807
    Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: July 9, 2019
    Assignee: BRIDGELUX INC.
    Inventor: R. Scott West
  • Patent number: 10334674
    Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: June 25, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Ghulam Hasnain, Syn-Yem Hu, Steven D. Lester
  • Patent number: 10325890
    Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: June 18, 2019
    Assignee: Bridgelux, Inc.
    Inventors: R. Scott West, Tao Tong, Mike Kwon, Michael Solomensky
  • Patent number: 10317027
    Abstract: Side light LED troffer tube. In an aspect, a side light LED tube is provided that includes a tube having at least one light receiving portion configured to receive light and gradient optics formed on the tube. The gradient optics providing a transparency gradient configured to distribute the light to achieve a selected emitted light intensity variation across a selected surface of the tube.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: June 11, 2019
    Assignee: BRIDGELUX INC.
    Inventor: Todd Farmer
  • Patent number: 10297731
    Abstract: Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: May 21, 2019
    Assignee: Bridgelux, Inc.
    Inventors: Vladimir A. Odnoblyudov, R. Scott West
  • Patent number: 10263163
    Abstract: An optical device capable of generating warm light using an array of phosphor islands situated over a phosphor layer is disclosed. The device includes a solid state light emitter, a phosphor layer, and phosphor islands. The solid state light emitter, in an aspect, is a light emitting diode (“LED”) capable of converting electrical energy to optical light. The phosphor layer is disposed over the solid state light emitter for generating luminous cool light in response to the optical light. Multiple phosphor islands are disposed on the phosphor layer for converting cool light to warm light, wherein the phosphor islands are evenly distributed over the phosphor layer.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: April 16, 2019
    Assignee: Bridgelux, Inc.
    Inventors: Tao Xu, Rene Peter Helbing
  • Patent number: 10256373
    Abstract: Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: April 9, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Babak Imangholi, Khashayar Phil Oliaei, Scott West