Abstract: Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs.

Abstract: LED module with integrated thermal spreader. In an aspect, an LED module is provided that includes an LED light source, a driver connected to energize the LED light source, and a thermal spreader thermally coupled to at least one of the LED light source and the driver, the thermal spreader configured to provide a thermal conduction path to conduct heat energy away from the LED module. In another aspect, a lighting device includes a heat sink and an LED module mated with the heat sink. The LED module includes an LED light source, a driver connected to energize the LED light source, and a thermal spreader thermally coupled to at least one of the LED light source and the driver, the thermal spreader forming a thermal conduction path with the heat sink to conduct thermal energy away from the LED module.