Abstract: The present invention relates to a light-emitting diode (LED) structure, which comprises an LED unit. The LED unit is doped with a plurality of fluorescent powders in at least an arbitrary layer on one side of a light-emitting layer. Alternatively, the LED unit includes a plurality of fluorescent powder particles arranged on at least a light-emitting surface of the LED unit. No gel is adopted for disposing or packaging fluorescent powders. Thereby, gel yellowing caused by long-term high-temperature heating of the LED structure will not occur. The yellowing phenomenon will affect the light-emitting efficiency of LED and induce color deviation.

Abstract: The present invention provides a color-mixing light-emitting diode module. According to the present invention, a first light-emitting chip and two second light-emitting chips are disposed on a holder. The first light-emitting chip emits red light and the plurality of second light-emitting chips emit white light. The red light and the white light are mixed, giving mixed light with high color rendering and brightness. Objects illuminated by the mixed light will exhibit colors closest to their original colors as perceived by eyes. Furthermore, by arranging the first and second light-emitting chips in matrix, the color rendering of the light-emitting diode module can be adjusted and improved.

Abstract: The present invention provides a color-mixing light-emitting diode module. According to the present invention, a first light-emitting chip and two second light-emitting chips are disposed on a holder. The first light-emitting chip emits red light and the plurality of second light-emitting chips emit white light. The red light and the white light are mixed, giving mixed light with high color rendering and brightness. Objects illuminated by the mixed light will exhibit colors closest to their original colors as perceived by eyes. Furthermore, by arranging the first and second light-emitting chips in matrix, the color rendering of the light-emitting diode module can be adjusted and improved.

Abstract: A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.

Abstract: A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.

Abstract: A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.

Abstract: A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.

Abstract: A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.

Abstract: A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.

Abstract: A lamp device includes a lamp housing embedded in an automobile body. The lamp housing has an outer housing part coupled to and disposed outwardly around an inner housing part. The outer housing part has a thermal conductivity coefficient less than that of the inner housing part. A transparent lamp cap is mounted to the lamp housing, is exposed from the automobile body, and cooperates with the inner housing part of the lamp housing to define a first inner space therebetween. A lighting module is disposed in the first inner space, and includes at least one light emitting diode.

Abstract: A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.

Abstract: A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.

Abstract: A lens for use with a light-emitting element includes a lens body that has a bottom surface for receiving light from the light-emitting element, a top surface opposite to the bottom surface along an optical axis, a peripheral surface extending and converging from the bottom surface to the top surface such that a projection of a perimeter of the top surface onto a plane of the bottom surface is surrounded by a perimeter of the bottom surface, and a textured structure formed on the top surface for scattering light that exits the top surface at angles relative to the optical axis.

Abstract: A solid state lighting device includes a heat-dissipating base, a diode chip, and a plurality of conductive terminals. The heat-dissipating base includes a base body formed integrally from a thermally conductive material. The base body has a top side, and is formed with a cavity that is indented from the top side. The base body further has a plurality of terminal channels, each of which extends from the cavity to an exterior of the base body. The diode chip is disposed in the cavity. Each of the conductive terminals extends through a respective one of the terminal channels, and has a first connecting part that is disposed in the cavity and that is coupled electrically to the diode chip, and a second connecting part that is disposed outwardly of the heat-dissipating base.

Abstract: A lens includes a lens body having a bottom surface, a reflective surface, and a refractive surface. The bottom surface is to be disposed proximate to a light-emitting component. The reflective surface is disposed opposite to the bottom surface along a lens axis, and reflects a first portion of the light provided by the light-emitting component that is incident thereon toward the refractive surface. The refractive surface extends from an edge of the reflective surface to the bottom surface, and refracts a second portion of the light provided by the light-emitting component that is incident thereon as well as the first portion of the light reflected by the reflective surface theretoward in sideward directions relative to the light-emitting component. The lens body has cross-sections transverse to the lens axis, sizes of which increase gradually from a junction of the reflective surface and the refractive surface toward the bottom surface.

Abstract: A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.