Abstract: A light-emitting module and a tandem light-emitting device include an insulating housing, a control chip, a light-emitting unit, and a plurality of pins. The insulating housing has an upper accommodating space and a lower accommodating space, the lower accommodating space is below the upper accommodating space directly, and the upper accommodating space forms an opening at the upper end of the insulating housing. The control chip is located in the lower accommodating space. The light-emitting unit is located in the upper accommodating space and is electrically connected to the control chip. A plurality of pins are exposed outside the insulating housing. The control chip can receive an electrical signal transmitted by an external control device through the pins to control the illumination of the light-emitting unit.

Abstract: A method of manufacturing a LED package structure for preventing lateral light leakage includes placing a plurality of light-emitting units on a carrier substrate, the light-emitting units being electrically connected to the carrier substrate; forming a plurality of light-transmitting gel bodies on the carrier substrate for respectively enclosing the light-emitting units, the light-transmitting gel bodies being separated from each other to form a gel receiving space among the light-transmitting gel bodies; forming a light-shielding gel body to fill up the gel receiving space; and then cutting the carrier substrate and the light-shielding gel body to form the plurality of LED package structures separated from each other, the carrier substrate being cut to form a plurality of circuit substrates for respectively carrying the light-emitting units.

Abstract: An LED base module includes a substrate and several driving units disposed on the substrate. Each driving unit includes a circuit layer, a separating wall, an LED driving component, a packaging member, and two electrodes. The circuit layer, the separating wall, and the electrodes are disposed on the substrate. A portion of the substrate corresponding to each driving unit is provided with an LED area and an electronic component area defined by the separating wall. The LED driving component is disposed on a portion of the circuit layer arranged in the electronic component area. The packaging member is formed on the electronic component area to entirely cover the LED driving component. A portion of the circuit layer arranged in the LED bonding area is used to bond to an LED chip, and the separating wall is configured to separate the LED chip and the LED driving component.

Abstract: An LED package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate. The light-emitting unit includes at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit includes a light-transmitting gel body disposed on the circuit substrate for enclosing the LED chip. The light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the LED chip, and the second light-transmitting portion has a light output surface. The light-shielding unit includes a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the second light-transmitting portion.