Abstract: A packaging structure, which includes a metal bracket, a driver chip, a light-emitting component, a packaging member and a metal cover plate. The metal bracket includes a plurality of pins, and first and second surfaces oppositely disposed. The driver chip is disposed on the first surface, and configured to control a light-emitting state of the light-emitting component. The light-emitting component is disposed on the second surface and electrically connected to the driver chip through the metal bracket. The packaging structure is disposed on the metal bracket, and configured to fix the metal bracket and enclose the driver chip and the light-emitting component. The pins are disposed surrounding the driver chip and are partially exposed from the packaging member. The metal cover plate is disposed on a side of the driver chip away from the light-emitting component, covering an entire surface of the driver chip.