Patents Assigned to Brintec Systems Corporation
  • Patent number: 4620757
    Abstract: There is disclosed herein a dual-in-line socket assembly which includes an insulator block having a plurality of socket-receiving apertures therein, each aperture adapted to receive an electrical socket. Each aperture has at one end a conically-shaped pin-receiving lead-in taper which opens into a cylindrical socket-receiving portion. An internal abutment shoulder is defined within the aperture at the junction af the lead-in taper and the socket-receiving portion. Electrical connector sockets are adapted to fit within the socket-receiving portion for receiving and electrically contacting a pin from an electrical device such as an integrated circuit chip.
    Type: Grant
    Filed: December 26, 1984
    Date of Patent: November 4, 1986
    Assignee: Brintec Systems Corporation
    Inventor: Armand Thevenaz