Abstract: A semiconductor package includes an interposer, a number of a first integrated circuit (IC) dies, one or more second IC dies, and one or more dummy dies. The first IC dies, the second IC dies and the dummy dies are implemented on the interposer. The dummy dies are configured to enable routing of pins of the first IC dies to selected circuits of the second IC dies while conforming to predefined routing rules.

Abstract: A semiconductor device, memory system, and method are provided. One example of the semiconductor device is disclosed to include a host interface that enables bi-directional communications with a host computer, a processor subsystem that enables processing of read or write requests received at the host interface, and one or more storage media interfaces, each of the one or more storage media interfaces being convertible between a first configuration and a second configuration, where the first configuration of a storage media interface enables a direct connection with a computer memory device, and where the second configuration of the storage media interface enables a connection with a plurality of computer memory devices via an expander and/or re-timer.