Abstract: Method for the metallic joining of parts which are formed by semiconductor components with metallization on at least one side or by metallic components or metallic substrates. A composite multilayer material is arranged between the parts to be joined together. Subsequently, the components are joined together at least under the action of defined heat such that only the surface layers directly facing the parts of the composite material are softened.

Abstract: A superconducting magnet system for particle acceleration of a synchrotron radiaton source having a particle orbit in a given plane includes a superconducting winding surrounding the particle orbit and having a slot formed therein in the given plane of the particle orbit for egress of synchrotron radiation, the superconducting winding having a cos .theta. shaped current distribution, where .theta. is the azimuth angle, and a mechanical support for the superconducting winding including at least one clamping element pre-tensioning the superconducting winding, and tightening elements in the vicinity of the slot pre-tensioning the superconducting winding in cooperation with the at least one clamping element.

Abstract: Centralized control receiver for power distribution networks, includes an input section containing at least one digital filter, an evaluating device, and an output section, the digital filter having a frequency response effecting selective damping of harmonic frequencies of at least one of the frequency of a respective network and control frequencies of at least one of adjacent centralized control services and of network-specific interference frequency ranges.

Abstract: A semiconductor power module includes a plastic housing, a ceramic substrate with upper and lower surfaces being disposed in the housing, upper and lower metallizations respectively disposed on the upper and lower surfaces of the substrate, components disposed on the upper metallization, at least one support having upper and lower parts and being disposed on the substrate in the housing, a first elastomeric soft casting compound disposed in the housing covering the substrate and the lower part of the at least one support, the upper part of the at least one support protruding from the first casting compound, and a second thermo-setting hard casting compound covering the upper part of the at least one support and connecting the upper part to the housing.

Abstract: A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from the semiconductor power component at the heating zone over an area of the condensation zone being larger than the given area, a highly heat-conducting ceramic base plate having two metallized sides, and a frame vacuum-tightly interconnecting the carrier plate and the base plate forming the vapor space of the heat pipe therebetween.

Abstract: A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area having a larger surface than the base surface, over which dissipation heat from the semiconductor power component is distributed.

Abstract: A drainage canal assembly includes a canal housing for receiving electrical components, a drainage canal in the form of a syphon formed in the canal housing, and a check valve disposed in the drainage canal permitting liquid to leave the canal housing but preventing liquid and dust from entering.

Abstract: A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.

Abstract: Production of superconducting fiber bundles where in a CVD reactor niobium carbonitride of the general formula NbC.sub.x N.sub.y is deposited on support fibers by means of chemical deposition from the vapor phase by reaction of niobium chloride, carbon and nitrogen compounds, and in addition to the mentioned reaction gases at least one oxygen-containing gas is introduced into the CVD reactor in a controlled manner.

Abstract: A magnetic tripping device for an electrical wiring device includes a U-shaped magnetic yoke, a cylindrical non-magnetic coil form having two end surfaces and a periphery and being disposed in the magnetic yoke, a magnetic core disposed in the coil form, a magnetic armature movably disposed in the coil form, and a compression spring disposed in the coil form between the magnetic core and the magnetic armature, the coil form having at least two radial embossings uniformly distributed over the periphery in the vicinity of the end surfaces for fixing the magnetic core in place in the coil form and for guiding the magnetic armature in the coil form with a limited stroke and a sliding fit.

Abstract: A measuring device housing includes two mutually assembled housing shells having mutually engaged dust protection edges, a trowel shape with a relatively narrow handle-type holder part changing into a relatively wide plate-type indicator part, an operating surface having sides, a switching wheel operating element mounted on the operating surface and extending beyond one of the sides thereof, and another operating element disposed on the operating surface laterally of the switching wheel, the operating elements being disposed within the swinging range of a thumb of the right hand of an operator of the measuring device gripping the holder part from behind for actuating the operating elements.

Abstract: Thermal insulation for placement in a gas-tight and at least partially evacuated space in a hollow chamber, including insulating material in fiber form, and at least one substance admixed to the insulating material for absorbing and/or scattering thermal radiation.

Abstract: Plastic cable with at least one electric conductor which is surrounded by a cable covering which, besides an insulating layer comprises several electrically conducting layers of a polymer material. At least one electrically conducting layer is made of a polymer, a mixed polymerizate or a polymer alloy which is meltable and/or soluble, and the electric conductivity of which can be adjusted to a defined value by a content of charge transfer complexes.

Abstract: Electrochemical storage cell of the sodium and sulfur type with an anode space and a cathode space which are separated from each other by a solid electrolyte and are bounded, at least in some regions, by a metallic housing. The cathode space contains the sulfur electrode which is made of a sulfur-impregnated graphite or carbon fiber material and the cathode space is subdivided into at least two and preferably more sectors which are separated from each other at least in some regions.

Abstract: Silicon semiconductor component with a wafer-like silicon semiconductor body with an edge contour made by an etching technique. The component has a p-region parallel to a principal surface of the semiconductor body and has in this principal surface a passivating ditch, into which leads a pn-junction extending between the more heavily doped p-region and a less heavily doped n-region, in which the edge contour has in the vicinity of a flank length, between the emergence of the pn-junction into the passivating ditch and this principal surface of the semiconductor body, a small angle of inclination of 1.degree. to 7.degree.. The angle of inclination (.alpha.) of the edge contour is nearly uniform over the major part of the flank length (L) and the following relationships apply:L=(0.8 . . . 1.6).multidot.x.sub.n andH=(0.5 . . . 1.2).multidot.x.sub.p, whereH=the height of the p-doped silicon layer over the pn-junction, measured in the center of the flank length (L),x.sub.

Abstract: A method for controlling a rotating-field machine supplied from an inverter, the output voltage system of the inverter being variable with respect to amplitude, phase and frequency includes supplying amplitudes of stator flux components formed from measured stator current components and stator voltage components as actual value of a flux control loop, and changing the phase and frequency of the inverter output voltage system with a flux control as a function of a predetermined stator flux reference value by directly setting-in the switching state of the inverter and an apparatus for carrying out the method.

Abstract: An explosion-proof plug includes a first casing part having two ends and an outer wall having an edge and defining a compression-resistant annular chamber being open toward one of the ends, an annular transformer disposed in the annular chamber, a cover secured to the first casing part covering the annular chamber and the transformer, a second substantially bowl-shaped casing part adjacent the edge of the outer wall, the second casing part and the cover together defining a first connection space with increased security as compared to other portions of the plug for receiving connecting cables to be connected to the transformer, a third casing part securely connected to the first casing part defining a second space of increased security, and plug pins being held in the third casing part and connected to the transformer.

Abstract: Rectifier module, including a frame forming a housing wall and having an open top and bottom, a ceramic plate cemented to the frame forming a housing bottom and having a side facing the interior of the housing and a side facing away from the interior of the housing, metallizations disposed on the side of the ceramic plate facing the interior of the housing forming conductor strips for soldering on semiconductor components, internal connecting straps, external connecting elements in the form of flat plugs having a broadened base part being soldered to one of the metallizations, an actual plug connector part being freely accessible from the top of the housing and an extension curve being disposed between the base part and the actual plug connector, the extension curve having a cross-sectional area being smaller than the cross-sectional area of the base and actual plug connector parts, a sealing compound filling substantially half of the housing, and a copper foil being disposed on the side of the ceramic plate

Abstract: Method for manufacturing a conductive plastic of a defined conductivity by forming a polymer alloy. A polar or nonpolar insulating polymer and a polar or nonpolar conductive polymer are used for forming the polymer alloy. The two polymers are mixed together and they are homogeneously distributed within the polymer alloy.

Abstract: Electrochemical storage cell of the sodium and sulfur type with an anode space and a cathode space which are separated from each other by a solid electrolyte and are bounded at least in places, by a metallic housing, with the cathode space for forming the sulfur electrode, filled with fiber material of graphite or carbon which is saturated with sulfur. A defined ratio of the value p of the thickness (d.sub.S) of the sulfur electrode to the wall thickness (d.sub.K) of the solid electrolyte is fixed.