Abstract: A debris collection and metrology system for collecting and analyzing debris from a tip used in nanomachining processes, the system including an irradiation source, an irradiation detector, an actuator, and a controller. The irradiation source is operable to direct incident irradiation onto the tip, and the irradiation detector is operable to receive a sample irradiation from the tip, the sample irradiation being generated as a result of the direct incident irradiation being applied onto the tip. The controller is operatively coupled to an actuator system and the irradiation detector, and the controller is operable to receive a first signal based on a first response of the irradiation detector to the sample irradiation, and the controller is operable to effect relative motion between the tip and at least one of the irradiation source and the irradiation detector based on the first signal.

Abstract: A large radius probe for a surface analysis instrument such as an atomic force microscope (AFM). The probe is microfabricated to have a tip with a hemispherical distal end or apex. The radius of the apex is the range of about a micron making the probes particularly useful for nanoindentation analyses, but other applications are contemplated. In particular, tips with aspect ratios greater than 2:1 can be made for imaging, for example, semiconductor samples. The processes of the preferred embodiments allow such large radius probes to be batch fabricated to facilitate cost and robustness.

Abstract: An atomic-force-microscope-based apparatus and method including hardware and software, configured to collect, in a dynamic fashion, and analyze data representing mechanical properties of soft materials on a nanoscale, to map viscoelastic properties of a soft-material sample. The use of the apparatus as an addition to the existing atomic-force microscope device.

Abstract: In one embodiment, an automatic high-speed X-ray system may generate a high-resolution X-ray image of an inspected sample at a direction substantially orthogonal to a plane of the inspected sample. The system may determine a first cross-sectional shape of a first portion of a first element of interest in the inspected sample based on grayscale values of the X-ray image associated with the first element of interest. The system may determine a second cross-sectional shape of a second portion of the first element of interest in the inspected sample. The second cross-sectional shape may be determined based on the grayscale values of the X-ray image associated with the first element of interest. The system may determine one or more first metrological parameters associated with the first element of interest in the inspected sample based a comparison of the first cross-sectional shape and the second cross-sectional shape.

Abstract: A method of operating an atomic force microscope (AFM), using a denoising algorithm, real-time, during AFM data acquisition. Total Variation and Non-Local Means denoising are preferred. Real time images with minimized sensor noise needing no post-image acquisition processing to account for noise as described herein results.

Abstract: An imaging spectroscopic ellipsometry apparatus and method configured to measure thin films with high spatial resolution. The apparatus includes a rotating compensator that enables to simultaneously collect both spectrometric ellipsometric data and ellipsometric imaging with the use of the same measurement beam of light. Collecting both data sets simultaneously increases the information content for analysis and affords a substantial increase in measurement performance.

Abstract: A method of batch-fabricating an array of probe devices for a surface analysis instrument, such as an atomic force microscope (AFM), includes providing a wafer, and photolithographically forming a base and a cantilever for each probe. The cantilever includes a built-in angle, ?, relative to the base, and the base is substantially parallel to a sample holder when the probe device is mounted in a probe holder of the surface analysis instrument.

Abstract: An atomic-force-microscope-based apparatus and method including hardware and software, configured to collect, in a dynamic fashion, and analyze data representing mechanical properties of soft materials on a nanoscale, to map viscoelastic properties of a soft-material sample. The use of the apparatus as an addition to the existing atomic-force microscope device.

Abstract: Methods and apparatus for obtaining extremely high sensitivity chemical composition maps with spatial resolution down to a few nanometers. In some embodiments these chemical composition maps are created using a combination of three techniques: (1) Illuminating the sample with IR radiation than is tuned to an absorption band in the sample; and (2) Optimizing a mechanical coupling efficiency that is tuned to a specific target material; (3) Optimizing a resonant detection that is tuned to a specific target material. With the combination of these steps it is possible to obtain (1) Chemical composition maps based on unique IR absorption; (2) spatial resolution that is enhanced by extremely short-range tip-sample interactions; and (3) resonant amplification tuned to a specific target material. In other embodiments it is possible to take advantage of any two of these steps and still achieve a substantial improvement in spatial resolution and/or sensitivity.

Abstract: An atomic force microscope (AFM) and method of operating the same includes a separate Z height sensor to measure, simultaneously with AFM system control, probe sample distance, pixel-by-pixel during AFM data acquisition. By mapping the AFM data to low resolution data of the Z height data, a high resolution final data image corrected for creep is generated in real time.

Abstract: A method for producing a radiation window includes patterning a photo resist structure onto a double-sided silicon wafer, plasma etching the silicon wafer to create an etched silicon wafer having a silicon supporting structure etched upon a first side of the double-sided silicon wafer, applying a silicon nitride thin film to the etched silicon wafer, patterning a photo resist structure and plasma etching a second side of the double-sided silicon wafer to create an initial window in the silicon nitride thin film, and wet etching the second side of the double-sided silicon wafer to release the silicon nitride thin film and supporting structure from the portion of the double-sided silicon wafer defined by the initial window.

Abstract: In one embodiment, an automated high-speed X-ray inspection system may generate a first X-ray image of an inspected sample at a first direction substantially orthogonal to a plane of the inspected sample. The first X-ray image may be a high-resolution grayscale image. The system may identify one or more elements of interest of the inspected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with the one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with respective elements of interest based on variations of grayscale values in the first X-ray images. The system may determine whether one or more defects are associated with the respective elements of interest based on the one or more first features associated with the element of interest.

Abstract: A spectroscopic ellipsometry system and method for thin film measurement with high spatial resolution. The system includes a rotating compensator so that spectroscopic ellipsometric and imaging ellipsometric data are collected simultaneously with the same measurement beam. Collecting both ellipsometric data sets simultaneously increases the information content for analysis and affords a substantial increase in measurement performance.

Abstract: An apparatus and method of operating an atomic force profiler (AFP), such as an AFM, using a feedforward control signal in subsequent scan lines of a large area sample to achieve large throughput advantages in, for example, automated applications.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: A probe assembly for a surface analysis instrument such as an atomic force microscope (AFM) that accommodates potential thermal drift effects includes a substrate defining a base of the probe assembly, a cantilever extending from the base and having a distal end, and a reflective pad disposed at or near the distal end. The reflective pad has a lateral dimension (e.g., length) between about twenty-five (25) microns, and can be less than a micron. Ideally, the reflective pad is patterned on the cantilever using photolithography. A corresponding method of manufacture of the thermally stable, drift resistant probe is also provided.

Abstract: An atomic-force-microscope-based apparatus and method including hardware and software, configured to collect, in a dynamic fashion, and analyze data representing mechanical properties of soft materials on a nanoscale, to map viscoelastic properties of a soft-material sample. The use of the apparatus as an addition to the existing atomic-force microscope device.

Abstract: In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.

Abstract: A system and method of operating an atomic force microscope (AFM) that includes providing relative scanning motion between a probe of the AFM and a sample in a slow scan direction of a data scan to generate a reference image (plane) of a region of interest. Then, relative scanning motion between the probe and the sample is provided in a fast scan direction of a final data scan to generate a data image. By mapping the data image against the reference image in real-time during the supplying step, the preferred embodiments generate a final drift corrected data image without post-image acquisition processing.