Abstract: The electrical conductivity of a wrought processed, high strength, age hardened Be—Cu alloy is enhanced by overaging the alloy in manufacture.

Abstract: A mold for use in die casting aluminum parts is made from an underaged Ni—Be alloy containing about 1.0 to 2.0 wt. % Be.

Abstract: The casting porosity of an unwrought casting made from an alloy having a large difference between its liquidus and solidus temperatures is reduced by subjecting the casting to hot isostatic pressing.

Abstract: A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.

Abstract: A shot block for use in a die casting machine for die casting molten and semi-molten metal parts is formed from a metal or metal alloy having a thermal conductivity of at least about 25 Btu/ft.hr.° F., a Rockwell C hardness of at least about 25 and a 0.2% Yield Strength of at least about 90 ksi.

Abstract: The thermal conductivity, thermal conductivity, of a sintered copper/refractory metal composite having a maximum porosity of about 1% is greatly improved when the composite contains phosphorus and sintering aid in a specified weight ratio, “phosphorus/sintering aid ratio.” The copper/refractory matrix composite herein comprises, by weight, from about 5% to about 30% copper, from about 0.2% to about 0.6% sintering aid, from about 0.08% to about 0.3% phosphorus, the remaining metal is refractory metal. The phosphorus to sintering aid ratio ranges from about 0.25 to about 0.55. In one embodiment of the invention the sintering aid contains cobalt and the refractory metal is tungsten.

Abstract: An electrical connector made from a Be-Cu alloy can be crimped at room temperature without localized annealing of the crimp section first. Sufficient ductility and tensile strength are imparted to the alloy by cold working the alloy, after final solution annealing, by at least 40% in terms of area reduction and then overaging the alloy during age hardening.

Abstract: A fluid powered drilling motor adapted for drilling oil wells and other subterranean bore holes. The motor having a rotor and a stator wherein the iron content of the whole motor is less than 0.1% wt. In one embodiment the motor is made of an alloy having a base metal comprising one of copper, nickel, and aluminum plus about 0.05-10 wt % Beryllium. In another embodiment, the motor is made of either 15Ni-8SN—Cu or 9Ni-6Sn—Cu.

Abstract: Large sections of solution annealed, precipitation hardenable alloys which are resistant to internal cracking yet fully hardenable can be produced if, during rapid quenching, the temperature of the section is allowed to stabilize immediately above the alloy's solvus temperature before the section is rapidly quenched. Preferably, the temperature of the section is allowed to stabilize a second time, this time at an elevated temperature not so high that significant phase changes occur, before the section is cooled to ambient.

Abstract: An improved thin walled threaded spacer for use in preventing thread galling in adjacent sections of drill pipe in a drill string is formed by mechanically deforming a strip of copper/beryllium alloy containing 2% beryllium to form a preform having a hollow, truncated conical section and then mechanically deforming the conical section to impart helical grooves therein.

Abstract: A high strength cast aluminum-beryllium alloy including magnesium represented by the formula (25-60% Al)+(40-75% Be)+(0.1-1.25% Mg)+(0<X≦5%)+(0<Y≦4%)+(0<Z≦0.75%)=100, wherein: X is at least one element selected from the group consisting of nickel, cobalt and copper; Y is at least one element selected from the group consisting of silicon and silver; and Z is at least one element selected from the group consisting of iron, titanium, zirconium, boron, antimony, strontium, germanium, scandium and the rare earth elements.

Abstract: An alloy for making weld gun arm castings comprises about 0.35 to 0.8 wt. % Be, about 0.2 to 0.9 wt. % Co and about 1.5 to 2.4 wt. % Ni, with the balance being Cu and incidental impurities, the (Ni+Co)/Be ratio in the alloy being at least about 4.

Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900° to 1500° F., (ii) warm worked at greater than about 30% strain at a strain rate {acute over (&egr;)} greater than or equal to about (2.210×107)/exp[(2.873×104)/(T+459.4°)], where T is in ° F., at the temperature, (iii) annealed at a temperature between 1375° and 1500° F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480° and 660° F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.

Abstract: A method for creating hermetic seals in semiconductor packages is provided. The method includes the applying a sealing glass to ceramic layers and placing a ceramic tape layer there between. The assemblage is then laminated and fired, or sintered, to marry the material layers together to form a hermetic seal. The hermetic seal made thereby may be incorporated into a wide variety of semiconductor devices including packages and feedthroughs.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be)+(0.40-1.25% Ni)+(0-0.25% Sn)+[0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C.

Abstract: An actuator armset for a computer disk drive, the armset having a bore for rotating about a spindle of the disk drive to position a transducer radially across a disk of the drive, components of the armset including a body, a coil housing, a crash stop, and a plurality of actuator arms, each component comprising a selected amount of beryllium, the amount of beryllium selected for each component differing necessarily from that for the other components, such that maximum armset performance is provided at a relatively low cost.

Abstract: A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are placed in contact with a ceramic layer and metal layer. The assembly, so formed, is then heated to a temperature at least equal to the melting point of the eutectic and no greater than the melting temperature of copper. Upon cooling of the eutectic, a bond forms bond the ceramic layer to the metal layer.

Abstract: Disclosed is a practical aluminum-based alloy containing 1 to 99 weight percent beryllium and improved methods for the investment casting of net shape aluminum-beryllium alloy parts.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.