Abstract: Organopolysiloxane compositions that cure by the addition reaction of silicon-bonded lower alkenyl radicals with silicon-bonded hydrogen atoms and which exhibit select adhesion to a variety of substrates. The compositions comprise an adhesion promoting mixture comprising an epoxy-functional compound, soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and and hydroxy end blocked hydrocarbons (glycols) thus giving release characteristics to metal substrates while maintaining adhesion to a thermoplastic substrate. Additionally, an additive may be used to produce surface lubricity after curing.

Abstract: Organopolysiloxane compositions that cure by the addition reaction of silicon-bonded lower alkenyl radicals with silicon-bonded hydrogen atoms and which exhibit select adhesion to a variety of substrates. The compositions comprise an adhesion promoting mixture comprising an epoxy-functional compound, soluble polydiorganosiloxanes and polycycloorganosiloxanes (linear and cyclic) thus giving release characteristics to metal substrates while maintaining adhesion to the thermoplastic substrate. Additionally, an additive may be used to produce surface lubricity after curing.

Abstract: Organopolysiloxane compositions that cure by the addition reaction of silicon-bonded lower alkenyl radicals with silicon-bonded hydrogen atoms and which exhibit select adhesion to a variety of substrates. The compositions comprise an adhesion promoting mixture comprising an epoxy-functional compound, soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and and hydroxy end blocked hydrocarbons (glycols) thus giving release characteristics to metal substrates while maintaining adhesion to a thermoplastic substrate. Additionally, an additive may be used to produce surface lubricity after curing.