Patents Assigned to BS TECHNICS CO., LTD.
  • Patent number: 12283398
    Abstract: Disclosed is a method of manufacturing an insulating sheet, comprising: forming at least a groove on a flat sheet; a first cutting step for cutting a side surface of the groove by irradiating a laser beam to a side surface of the sheet; a second cutting step for cutting the insulating sheet to completely separate the groove from the insulating sheet by irradiating a laser beam from above the groove having the side surface cut; a tape attaching step for attaching a tape to an outer surface of the insulating sheet; and a bending step for bending one end portion of the surface of the insulating sheet having the tape attached toward a place where the tape is attached. It is possible to mass-produce the insulating sheets having a three-dimensional shape, regarded as being difficult to manufacture with a mold.
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: April 22, 2025
    Assignees: BS TECHNICS Co., Ltd., KOREA ELECTRIC TERMINAL CO., LTD
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Yeon Jo
  • Patent number: 12065073
    Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: August 20, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park
  • Publication number: 20240179850
    Abstract: An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., BS TECHNICS CO., LTD., INTOPS CO., LTD.
    Inventors: Chunghyo JUNG, Chiyoung YOON, Jungsik CHOI
  • Publication number: 20230356652
    Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 9, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, BS TECHNICS CO., LTD., NIFCO KOREA INC., HYUNDAI MOBIS CO., LTD., ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Jun Sik Kim, Jung Sik Choi, Young Do Kim, Tae Kyoung Jung, Seung-Sik Han, Hong-Sik Chang, Kwang-Pyo Cho, Young-Ju Lee, Jong-Hyun Park, Jin-Won Lee, Jun-Geun Oh, Cheon-Ho Kim, Young-Jai Im, Sun-Mi Oh, Kang-Sun Lee, Sae-Ah Kim, Jong-Eun Park, Kwan-Woo Lee, Jong-Chae Lee, Jun-Hyun Park, Won-Il Lee, Dae-Woo Park