Abstract: The present disclosure relates to a kernel-type earphone which is capable of easily implementing a pressure balance structure while hardly affecting acoustic characteristics of a speaker unit by using an existing general diaphragm and an existing general gasket.

Abstract: The present invention relates to a hybrid speaker, having a high-frequency tweeter and a low-frequency woofer formed on the same axis, for improving sound quality by separately emitting a high-frequency sound generated by the high-frequency tweeter and a low-frequency sound generated by the low-frequency woofer. A device according to the present invention comprises: a woofer part for generating a low-frequency sound; a tweeter part for generating a high-frequency sound; a substrate for supplying an electrical signal to coils of the woofer part and the tweeter part; a lower frame for accommodating constituent components on the same axis; and an upper frame coupled to the lower frame to form a speaker housing, and separately having a low-frequency sound emission port for emitting the low-frequency sound of the woofer part and a high-frequency sound emission port for emitting the high-frequency sound of the tweeter part.

Abstract: There is provided a microphone device comprising: a substrate having top and bottom portions, wherein the substrate has a cavity defined therein, wherein the cavity is open at the bottom portion of the substrate; a two-dimensional piezoelectric layer disposed on the top portion of the substrate, wherein the two-dimensional piezoelectric layer blocks a top of the cavity; and first and second electrode layers respectively arranged on both lateral end portions of the two-dimensional piezoelectric layer, wherein the first and second spaced electrode layers are spaced apart and electrically insulated from each other, wherein an electric potential energy is generated between the first and second electrode layers via piezoelectricity of the two-dimensional piezoelectric layer when the two-dimensional piezoelectric layer vibrates by sound energy applied thereto, wherein the piezoelectricity is generated in a parallel direction to a plane of the two-dimensional piezoelectric layer.

Abstract: A locking module of a wire auto-winding device includes a first case having a coupling projection formed thereon; a rotating piece inserted over the coupling projection of the first case in order to be rotated clockwise or counterclockwise; a button member coupled to the rotating piece and being slid in a first direction to rotate the rotating piece by means of a button operation; a stopper member coupled to the rotating piece to be slid in a second direction by means of the rotation of the rotating piece; a resilient spring for pushing and returning one of the button member or the stopper member in the opposite direction; and a second case fastened to the first case to form a component receiving space therein.

Abstract: A directional microphone and an operating method thereof include a first signal generator generating a first sound signal corresponding to a front sound coming through a front sound hole of the directional microphone. A second signal generator generates a second sound signal corresponding to a rear sound coming through a rear sound hole of the directional microphone. A phase delay controller delays a phase of the rear sound coming through the rear sound hole, and a signal processor synthesizes the first sound signal and the second sound signal.

Abstract: A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.

Abstract: A method of manufacturing a microphone assembly having an ear set function includes assembling a mike cell unit; obtaining a region for connection with the mike cell unit on a PCB, mounting only a conductive member in the region, and mounting other remaining components outside the region; adhering the mike cell unit to a corresponding region of the PCB; and sealing an adhering portion between the mike cell unit and the PCB. Assembling the mike cell unit includes inserting a mike cell case having a sound hole and a curing portion into a diaphragm assembly; stacking a spacer on the diaphragm assembly; inserting a back electrode plate into an insulating ring base; mounting the insulating ring base on the spacer; mounting a metal ring base on the insulating ring base; and curing or clamping a curing portion of the mike cell case.

Abstract: A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.

Abstract: A directional microphone and an operating method thereof include a first signal generator generating a first sound signal corresponding to a front sound coming through a front sound hole of the directional microphone. A second signal generator generates a second sound signal corresponding to a rear sound coming through a rear sound hole of the directional microphone. A phase delay controller delays a phase of the rear sound coming through the rear sound hole, and a signal processor synthesizes the first sound signal and the second sound signal.

Abstract: A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

Abstract: An electrostatic speaker including a frame; a first electrode installed at a first end of the frame; a second electrode installed at a second end of the frame to be at a predetermined distance apart from the first electrode; a suspension which is arranged between the second electrode and the first electrode and is elastically installed inside the frame; and a diaphragm assembly which is supported by the suspension and has a multilayer structure. The electrostatic speaker adopts a dual electrode structure, has the multilayer structure formed inside the diaphragm assembly, and is provided with a driving chip that applies a bias voltage to the diaphragm assembly by rectifying an audio signal after applying a driving signal that has amplified the audio signal to the dual electrodes. Thus, the invention does not require any external power, and is also capable of maintaining relatively high sensitivity by enhancing the charge density.

Abstract: A voice coil using a surface mount technology (SMT) to connect the voice coil and an electrode to each other, and a SMT speaker using the voice coil. A voice coil assembly includes a voice coil formed by stacking a plurality of laminated metal plates; and a flexible printed circuit board (FPCB) for impedance matching between the voice coil and an electrode terminal for connecting an external device and for connecting the voice coil to the electrode terminal. The laminated metal plates of the voice coil are connected in series or in parallel to each other. An active device is installed on the FPCB so as to amplify a signal input through the electrode terminal and to apply the signal to the voice coil. Since the voice coil is formed by stacking the laminated metal plates and is connected to the electrode terminal through the FPCB, a SMT is used to manufacture the SMT speaker, thereby improving productivity and reliability.

Abstract: A fabrication method of a silicon condenser microphone having an additional back chamber. The method includes applying an adhesive on a substrate and mounting a chamber container thereon by using a mounter; curing the adhesive holding the chamber container; applying an adhesive on the chamber container and mounting a micro electro mechanical system (MEMS) chip thereon by using a mounter; curing the adhesive holding the MEMS chip; and attaching the substrate on which devices are mounted to a case, wherein a back chamber formed by the chamber container is added to a back chamber of the MEMS chip. Therefore, a silicon condenser microphone fabricated by using the method may have improved sensitivity by increasing the small back chamber space of the a micro electro mechanical system (MEMS) chip itself and reduced noise including total harmonic distortion (THD).

Abstract: A microphone assembly, in which a microphone component and an ear set component are formed on the same printed circuit board, and a method of manufacturing the microphone assembly. In the microphone assembly, one electrode of a power supplier is connected to a diaphragm assembly through a grounding pattern of the PCB and a mike cell case and the other electrode of the power supplier is supplied to a back electrode plate through a conductive member to charge two electrodes. When an acoustic signal is input to the mike cell unit, the diaphragm assembly vibrates, and thus, an electrostatic capacity of the mike cell unit changes. The acoustic signal is transmitted to a field effect transistor (FET) mounted outside the mike cell unit along a signal pattern of the PCB and is processed by the FET.

Abstract: A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

Abstract: A condenser microphone that is manufactured by attaching components installed in a case by using curling to prevent movement of the components when the case and a printed circuit board (PCB) are welded to each other and to stably transfer electrical signals, and a method of manufacturing the condenser microphone. The condenser microphone using curling includes a case sub assembly prevented from moving by mounting a diaphragm, a spacer, a back plate, and a first base in a case with an open side and then curling an end portion of the open side; a printed circuit board (PCB); and an adhesion portion for adhering the case sub assembly and the PCB sub assembly to each other. A curling portion is formed on the end portion of the open side of the metal case and is curled. In addition, slits are formed in opposite lower ends of the curling portion.

Abstract: A welding type condenser microphone using a spring base to prevent interferences due to deviations of thicknesses of components, wherein a second base is an elastic spring. The welding type condenser microphone includes a case sub-assembly, in which a diaphragm and a back plate face each other across a spacer in a metal case and the back plate is insulated from the case by a first base formed of an insulation material; a printed circuit board (PCB) sub-assembly, in which circuit devices and a second base, which is an elastic spring, are mounted on a PCB via a surface mounting technology (SMT) method; and a unit for attaching the case sub-assembly and the PCB sub-assembly to each other. Furthermore, the second base is a leaf spring that is bent once, a U-shaped leaf spring having wings, or a coil spring.

Abstract: A magnetic circuit and a speaker including the magnetic circuit. The speaker includes: a bottom case; a magnetic circuit including a perpendicular-magnetized permanent magnet and a horizontal-magnetized permanent magnet spaced apart from each other by a predetermined interval; a diaphragm; a voice coil attached on a surface of the diaphragm, disposed in a magnetic gap between the perpendicular-magnetized permanent magnet and the horizontal-magnetized permanent magnet and which vibrates the diaphragm; and a front cover coupled to the bottom case to fix the magnetic circuit and the diaphragm. The magnetic circuit includes a perpendicular-magnetized permanent magnet and a plurality of horizontal-magnetized permanent magnets.

Abstract: A variable directional microphone assembly and method of manufacturing the variable directional microphone assembly which includes a substrate, a semiconductor integrated circuit device, two microphone devices, a microphone body, and a case.

Abstract: Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.