Patents Assigned to BT Engineering
  • CONTROLLED IMPEDANCE PCB ENCAPSULATION
    Publication number: 20150077961
    Abstract: The present invention discloses methods and devices for encapsulating PCBs, assemblies of PCBs, and their electronic components. The encapsulation methods disclosed can be used to produce electromagnetic shields whose impedance is controlled.
    Type: Application
    Filed: January 28, 2013
    Publication date: March 19, 2015
    Applicant: BT Engineering
    Inventors: Jack Thiesen, Karl Brakora