Abstract: A modular fluid-dispensing system includes a master control dispenser and/or one or more satellite dispensers that communicate bi-directionally with the master control dispenser. The master control dispenser is programmable and may dispense one or more solutions. Each satellite may dispense fluid in either a stand-alone mode or under control of another fluid-dispensing-system component, such as a master control dispenser, or a grinder/polisher. A master control dispenser may store various multi-step dispensing methods and may advance a dispensing method to a next step automatically or based on a control signal received from a grinder/polisher. A master control dispenser may perform a fluid-dispensing method that is synchronized with a corresponding grinder/polisher method performed by a grinder/polisher that is coupled to the master control dispenser.

Abstract: A modular fluid-dispensing system includes a master control dispenser and/or one or more satellite dispensers that communicate bi-directionally with the master control dispenser. The master control dispenser is programmable and may dispense one or more solutions. Each satellite may dispense fluid in either a stand-alone mode or under control of another fluid-dispensing-system component, such as a master control dispenser, or a grinder/polisher. A master control dispenser may store various multi-step dispensing methods and may advance a dispensing method to a next step automatically or based on a control signal received from a grinder/polisher. A master control dispenser may perform a fluid-dispensing method that is synchronized with a corresponding grinder/polisher method performed by a grinder/polisher that is coupled to the master control dispenser.

Abstract: A magnetic disc system for grinding or polishing metallographic test specimens on a movable platen includes a barrier that is magnetically attached to a movable platen. A grinding or polishing surface attaches to the barrier. The barrier magnetically attaches to the platen and is also capable of blocking or greatly reducing the magnetic field magnetism from passing through to the grinding or polishing surface and restricting or preventing swarf adhesion resulting from the polishing or grinding operation that could harm the prepared surface.

Abstract: Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.

Abstract: An automatic sample preparation system for polishing and grinding metallurgical and other samples prior to microscopic examination of the samples, including a rack which holds a plurality of abrasive platens, and platen transfer mechanism for selecting one platen from the rack and transferring the same to a platen drive plate for a polishing operation and for later returning the platen to the rack and transferring another selected platen to the platen drive plate, and a polishing head which can be rotated between a polishing position for polishing samples and a wash position where it is over a wash and dry station, the platen transfer mechanism being operated when the polishing head is rotated to its wash position.

Abstract: An improved mechanism for applying a controlled load to a specimen being polishing in an automatic polishing machine including a tension spring for exerting a downward load which is transmitted to the specimen to press the same against an abrasive polishing member, and a stepper motor connected by a plurality of mechanical elements to one end of the tension spring whereby through use of a microprocessor the stepper motor may be operated to control the load applied to the specimen.

Abstract: A goniometer arm for use in conjunction with a precision cutting apparatus comprising an arm for supporting a rotating adaptor arm which in turn supports and secures a rotating disc and a specimen holder. The goniometer arm allows a specimen to be cut along a specific plane about a specific axis.

Abstract: An automatic saw is provided having a rotatable saw blade for cutting through a workpiece which is carried on a movable arm, which permits the workpiece to be moved into engagement with the saw blade. The saw blade is mounted on a first shaft while the workpiece and arm are mounted on a second, rotary shaft. Typically, a load cell is carried on the second shaft to sense torsional stress created by the pressure of the saw against the workpiece. This torsional stress is a direct measurement of the pressure of the saw against the load cell, and may be used in a feedback system for automatic adjustment of the sawing conditions. Also, it is preferred for the second shaft to be longitudinally movable in an automatic manner by means of a threaded, rotary arrangement for longitudinally advancing and retracting the second shaft between predetermined positions. A rotary encoder may be used to monitor the rotary position of the second shaft and arm.

Abstract: A mechanochemical polishing abrasive and a process for using the mechanochemical polishing abrasive to polish the surface of a hardened workpiece cheaply and efficiently. The mechanochemical polishing abrasive comprises a slurry of colloidal silica and a mechanical abrasive selected from one or more of the materials in the group comprising Fe.sub.2 O.sub.3, Fe.sub.3 O.sub.4, MgO, BaCO.sub.3, CaCO.sub.3, MnO.sub.2, CeO, SiO.sub.2, CeO.sub.2, Cr.sub.2 O.sub.3, and Al.sub.2 O.sub.3.

Abstract: Molding apparatus, particularly for mounting specimens for microstructural analysis. A ramhead pressurizes a molding chamber, with the pressure, temperature and time of the cycle being set into the system from a control panel and proceeding automatically. The ramhead is advanced through a hydraulic system. A spring is provided for mounting the tubular molding chamber to permit the molding chamber to spontaneously align with the advancing ramhead. A wrench member is provided as an integral part of the apparatus to rotationally lock the handle to the molding chamber, to permit rotation of the molding chamber through the handle for removal thereof when desired.

Abstract: A saw apparatus comprises an operatable saw blade and a holding arm for gripping an object to be sawed, plus means for moving the saw blade and holding arm together to cause the saw blade to engage the object for sawing under controlled-pressure conditions. The saw blade is carried by strain gauge means, the strain gauge means being part of electronic means for sensing the load of the operatable saw blade on the strain gauge means. Thus, pressure of the object for sawing against the top of the saw blade causes an increase in the load sensed by the strain gauge. The electronic signal generated thereby may be used in a feedback system to control the pressure of the workpiece against the saw blade.

Abstract: Apparatus for polishing or grinding specimens in which the pressure between the sample and the platen against which it presses for grinding or polishing is controlled by a feedback system, which includes a strain gauge from which the sample-holding grinding shaft is suspended.

Abstract: An abrasive cutting system has an abrasive cutting wheel, a holder for the object to be cut, and means for advancing and retracting the wheel and holder relative to each other. Preferably, the advancing and retracting means is connected to the holder, while the cutting wheel is stationary except for its rotary motion. In accordance with this invention, apparatus for automatically, intermittently advancing the wheel and holder toward each other while the wheel is cutting the object is provided. This automatic, intermittent advancement provides significant improvements over a uniform rate of advancement.

Abstract: Apparatus for polishing the ends of multiple fiber optic members to a precise predetermined length. The invention relates in particular to appartus for gripping and holding a plurality of fiber optic connectors, each of which has a fiber optic cable connected thereto with a small fiber optic end projecting. The apparatus serves to accurately hold and position a large number of such fiber optic connectors and advance them under controlled conditions of speed and force into engagement with a polishing member such as a rotatable platen having an abrasive surface.

Abstract: An abrasive slurry supply system for use in conjunction with a polisher or grinder or the like for preparing the surface of a metallurgical specimen, the system comprising an abrasive slurry reservoir, a first source of air under pressure connected with the reservoir to force the slurry to a spray nozzle, and a second source of air under pressure connected to the nozzle to transform the slurry from a liquid to an atomized mist which is directed to a rotatable platen or lapping wheel of the polisher/grinder machine for use in the preparation of metallurgical specimens.

Abstract: A surface inspection microscope for examining the surface finish of a fiber optic end, the microscope including a fitting for attaching the end of a fiber optic connector, an eyepiece for viewing the fiber optic end, a light source within the microscope for transmitting light along the length of the optic cable, and reflector means for positioning against the opposite end of the fiber optic cable to reflect light from the light source back along the length of the fiber optic cable thereby enhancing the contrast between the end of the fiber optic core and the cladding material which surrounds the core.

Abstract: An apparatus for impregnating porous samples for materials evaluation with an inert material which fills the pores of the samples. A plurality of samples are placed in mold cups on a rotatable table within a vacuum chamber, and a supply of impregnant or encapsulant material such as an epoxy resin is provided in a container mounted on a tiltable platform located above the rotatable table. A plurality of samples are thus mounted in respective molding cups spaced in a circle on the rotatable table, a supply of encapsulant material is provided in a cup placed in a cup holder on the tiltable platform, a vacuum is created within the chamber, and the table is intermittently rotated to position each molding cup with its sample in line with the tilt axis of the tiltable platform to permit tilting of the encapsulant cup to pour a supply of resin into the molding cup.

Abstract: Method and apparatus for high volume preparation of cross-sectional specimens of printed circuit boards for microscopic examination, including a method and apparatus for precision mounting of a large number of such cross sections in a single molding sequence for simultaneous polishing of such cross sections in a single polishing operation.

Abstract: A method and apparatus for polishing the ends of fiber optic connectors by gripping an end to be polished and yieldingly urging it against a moving abrasive member in a manner so as to gradually build up the force between the fiber optic end and the abrasive member from an initial low force to a maximum force.

Abstract: Apparatus for high volume preparation of cross-sectional specimens of printed circuit boards for microscopic examination, including a method and apparatus for precision mounting of a large number of such cross sections in a single molding sequence for simultaneous polishing of such cross sections in a single polishing operation.