Abstract: Disclosed is a micro speaker module capable of reducing the thickness of an enclosure that supports a micro speaker. The enclosure of the disclosed micro speaker module includes a first frame having a supporting portion configured to support the micro speaker, and a second frame configured to cover an open side of the first frame. A first cover and a second cover are respectively insert injection molded with or attached to portions of the first frame and the second frame corresponding to the micro speaker that is supported by the supporting portion, which results in a reduction in the thickness of each frame.

Abstract: A speaker for a mobile communication terminal is provided. The speaker with an upper case, a frame, a vibration plate, a voice coil, a yoke, a magnet, a top plate and a printed circuit board (PCB) includes a housing for accommodating the vibration plate, the voice coil, the yoke, the magnet and the top plate, the housing being formed by coupling the upper case and the frame, a sound emission hole formed in one side surface of the housing, a sound pressure adjustment hole formed by penetrating the upper case, and a resonance space formed in an outer circumference of the upper case. In the speaker, it is possible to elevate degree of space utilization in the mobile communication terminal, to easily manufacture a mobile communication terminal which parallels the trend toward miniaturization, slimness and lightness, to improve the characteristics of low frequency sound, and thus to improve sound quality.