Patents Assigned to Business Electronics Soldering Technologies, Inc.
  • METHOD FOR THE MANUAL PLACEMENT OF BOTTOM TERMINATED LEADLESS DEVICE ELECTRONIC PACKAGES USING A MATED STENCIL PAIR
    Publication number: 20100147928
    Abstract: The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads.
    Type: Application
    Filed: December 10, 2009
    Publication date: June 17, 2010
    Applicant: Business Electronics Soldering Technologies, Inc.
    Inventors: Robert P. Wettermann, Hung Hoang, Raymond A. Cirimele