Abstract: Improvements are disclosed in the conventional process for the laminated packaging of etched circuitry consisting of:(1) A unitized form tool which is produced by photomasking a metal plate, with the same pattern master transparency that is used for producing the photoetched circuitry, followed by chemical milling of the exposed areas to a depth equal to the thickness of the circuitry,(2) the manufacturer's low pressure dwell cycle in the press for prepreg containing epoxy resin or polyimide resin is for either resin changed to 210.+-. 15 secs. at 10.+-. 1 psi and 340.degree. F.