Patents Assigned to BUTECH BUILDING TECHNOLOGY S.A.
  • Patent number: 9090030
    Abstract: Procedure for the manufacturing of pieces for the formation of a removable floor covering and the covering obtained includes obtaining by molding a joint made of a polymer material (1) that is mounted on the contour of a resistant plate (4). On the back of the plate is molded, inside a mold, and by an elastomer material, a layer (15) of shock-absorbing material provided with nerves (16) and conformations (18) on its free surface for the coupling of the intermediate joining elements between the covering pieces.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: July 28, 2015
    Assignee: Butech Building Technology, S.A.
    Inventor: Jose Luis Fenollosa Esteve
  • Publication number: 20130160397
    Abstract: Procedure for the manufacturing of pieces for the formation of a removable floor covering and the covering obtained includes obtaining by molding a joint made of a polymer material (1) that is mounted on the contour of a resistant plate (4). On the back of the plate is molded, inside a mould, and by an elastomer material, a layer (15) of shock-absorbing material provided with nerves (16) and conformations (18) on its free surface for the coupling of the intermediate joining elements between the covering pieces.
    Type: Application
    Filed: August 5, 2010
    Publication date: June 27, 2013
    Applicant: BUTECH BUILDING TECHNOLOGY, S.A.
    Inventor: Jose Luis Fenollosa Esteve
  • Publication number: 20100269441
    Abstract: Disclosed herein are demountable or removable floor coverings. The floor coverings have independent floor pieces that comprise a lower shock-absorbing layer and a resistant covering upper layer. The lower layer generally has equal recesses from its edges, where the recesses have a choked outlet. The independent floor pieces are joined together by means of intermediate joining elements which are tightly coupled in opposite recesses of adjacent independent floor pieces.
    Type: Application
    Filed: October 5, 2009
    Publication date: October 28, 2010
    Applicant: BUTECH BUILDING TECHNOLOGY S.A.
    Inventor: JOSE LUIS FENOLLOSA ESTEVE