Abstract: Aspects of the technology described herein relate to methods and apparatuses for identifying gestures based on ultrasound data. Performing gesture recognition may include obtaining, with a wearable device, ultrasound data corresponding to an anatomical gesture; and identifying the anatomical gesture based on the obtained ultrasound data. Interfacing with a computing device may include identifying, with a wearable device, an anatomical gesture using ultrasound data obtained by the wearable device; and causing the computing device to perform a specific function based on the anatomical gesture identified by the wearable device.

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Abstract: Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.

Abstract: Aspects of the technology described herein relate to an ultrasound device having a first analog-to-digital converter (ADC) configured to operate with a first ADC clock signal having a first timing delay and a second ADC configured to operate with a second ADC clock signal having a second timing delay. The first timing delay and the second timing delay may be different. The ultrasound device may further include delay control circuitry configured to control direct digital synthesis (DDS) circuitry to implement a first delay in ultrasound data from the first ADC and a second delay in ultrasound data from the second ADC. The first delay may correct for the first timing delay and the second delay may correct for the second timing delay.

Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.

Abstract: Aspects of the technology described herein relate to automatically calculating an ultrasound pulse transmission direction and configuring an ultrasound device to transmit ultrasound pulses along the ultrasound pulse transmission direction for pulsed wave Doppler ultrasound imaging. Automatically calculating the ultrasound pulse transmission direction may be based on a selected sample volume within a subject where flow velocity is to be measured with the pulsed wave Doppler ultrasound imaging, and a selected direction of the flow velocity to be measured with the pulsed wave Doppler ultrasound imaging.

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.

Abstract: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.

Abstract: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.

Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.

Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.

Abstract: Aspects of the technology described herein related to monitoring fetal heartbeat and uterine contraction signals. An ultrasound system may be configured to sweep a volume to collect ultrasound data, detect a fetal heartbeat and/or uterine contraction signal in the ultrasound data, and automatically steer an ultrasound beam to monitor the fetal heartbeat and/or uterine contraction signal. The ultrasound system may be further configured to determine a location where the fetal heartbeat and/or uterine contraction signal is detectable or detectable at a highest quality. The ultrasound system may include a wearable ultrasound device, such as an ultrasound patch coupled to a subject. The wearable ultrasound device may have a two-dimensional array of ultrasonic transducers capable of steering ultrasound beams in three dimensions.