Abstract: A removable cable connector engages with an electronic device such that the removable cable connector removably yet securely attaches to the electronic device. In some embodiments, the electronic device includes a plate configured to guide an electronic plug of the removable cable connector toward an electronic receptacle of the electronic device. The plate may be further configured to include one or more locators for holding the electronic receptacle of the electronic device in place. The removable cable connector may include a molded housing formed using a two-shot overmolding process to form a first overmolded strain relief portion and a second overmolded strain relief portion which cover fasteners that fasten a face plate to the connector.

Abstract: Micromachined ultrasonic transducers having a self-assembled monolayer formed on a surface of a sealed cavity are described. A micromachined ultrasonic transducer may include a flexible membrane configured to vibrate over a sealed cavity, and the self-assembled monolayer may coat some or all of the interior surfaces of the sealed cavity. During fabrication, the sealed cavity may be formed by bonding the membrane to a substrate such that the sealed cavity is between the membrane and the substrate. An access hole may be formed through the membrane to the sealed cavity and the self-assembled monolayer is formed on surface(s) of the sealed cavity by introducing precursors into the sealed cavity through the access hole.

Abstract: Aspects of the technology described herein relate to a capacitive micromachined ultrasonic transducer (CMUT) and a heater disposed in the CMUT, and forming a capacitive micromachined ultrasonic transducer (CMUT) and a heater disposed in the CMUT. A voltage may be applied to a heater disposed in a CMUT in an ultrasound imaging device in order to cause the heater to generate heat. Based on determining that the collapse voltage of the CMUT has increased by at least a threshold voltage between two times, a voltage may be automatically applied to a heater in the CMUT such that the heater generates heat.

Abstract: Aspects of the technology described herein relate to detection of one or more touches by an ultrasound device. An ultrasound device may include touch detection circuitry and may be configured to detect, with the touch detection circuitry, one or more touches on an exterior touch surface of the ultrasound device during ultrasound imaging, and to transmit an indication of detection of the one or more touches to a processing device in operative communication with the ultrasound device during the ultrasound imaging. The processing device may be configured to, in response to receipt of the indication from the ultrasound device, perform an action to control an aspect of the ultrasound imaging based on information included in the received indication. The touch detection circuitry may include capacitive sensing circuitry and/or resistive sensing circuitry to detect a touch made with little or no force.

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

Abstract: An ultrasonic transducer array includes a plurality of functional micromachined ultrasonic transducers (MUTs), each having a cavity of a first diameter. One or more groups of non-functional MUTs are disposed about a perimeter of the functional MUTs, the one or more groups of non-functional MUTs having a cavity of a second diameter that is smaller than the first diameter.

Abstract: Beamforming circuitry for an ultrasound device is disclosed, that may directly calculate the position in receive line space for an incoming ultrasound data sample given the time of flight (ToF) of that ultrasound data sample. In some embodiments, this may be done without initially buffering the ultrasound data sample received from the particular receive datapath multiplexed to the beamforming circuitry. The beamforming circuitry may then associate the ultrasound data sample with that position in receive line space, and in particular, with a memory address corresponding to that location. Thus, when the beamforming circuitry multiplexes between different receive datapaths, it may not need to buffer ultrasound data samples from different receive datapaths prior to saving the data to memory.

Abstract: Aspects of the technology described herein relate to enhancing ultrasound data. Some embodiments include receiving ultrasound data and automatically determining, with a processing device, that the ultrasound data depicts an anatomical view or one of a set of anatomical views. Based on automatically determining that the ultrasound data depicts the anatomical view or one of the set of anatomical views, an option is enabled to perform ultrasound data enhancement specific to the anatomical view or the set of anatomical views. Based on receiving the selection of the option, the ultrasound data, a portion thereof, and/or subsequently-collected ultrasound data is enhanced using the ultrasound data enhancement specific to the anatomical view or the set of anatomical views.

Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.

Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.

Abstract: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.

Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.

Abstract: An ultrasonic transducer device includes a bottom electrode layer of a transducer cavity disposed over a substrate. The bottom electrode layer includes a bottom layer of a first type metal; a top layer of the first type metal; a second type metal disposed between the bottom layer and the top layer; and at least one intermediate layer of the first type metal disposed between the bottom layer and the top layer, the at least one intermediate layer configured so as to define at least two discrete layers of the second type metal.

Abstract: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.

Abstract: Aspects of the technology described herein relate to detection of one or more taps by an ultrasound device. An ultrasound device may comprise tap detection circuitry and be configured to detect, with the tap detection circuitry, one or more taps on an exterior of the ultrasound device during ultrasound imaging, and transmit an indication of the detection of the one or more taps to a processing device in operative communication with the ultrasound device during the ultrasound imaging. A processing device in operative communication with the ultrasound device may be configured to receive, from the ultrasound device, an indication of detection of one or more taps on an exterior of the ultrasound device during ultrasound imaging, and perform an action controlling an aspect of the ultrasound imaging based on receiving the indication of the detection of the one or more taps from the ultrasound device.

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

Abstract: Aspects of the technology described herein related to modifying the location of an ultrasound imaging plane. Some embodiments include modifying the location of the ultrasound imaging plane based on a user selection. For example, some embodiments include receiving the user selection through a graphical user interface (GUI) that includes an ultrasound imaging plane indicator, where the ultrasound imaging plane indicator indicates the location of the ultrasound imaging plane. As another example, some embodiments include receiving the user selection by detecting tilts, taps, or voice commands. Some embodiments include automatically modifying the location of the ultrasound imaging plane. Some embodiments include modifying the location of the ultrasound imaging plane during biplane imaging.

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.