Patents Assigned to Bystronic Laser AG
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Patent number: 12285820Abstract: A control unit for calculating a spatially and time-resolved, combined setpoint data set for control of a laser cutting process includes a measurement data interface for accessing sensor data during the cutting operation, a process interface to a first memory that stores a process model that estimates status data of the laser cutting process and a cutting result, a machine interface to a second memory in which a machine model is stored which represents a kinematic behaviour of the laser cutting head and estimates status data of a movement process and the cutting result thereof, and a processor that executes an algorithm that couples the process model and the machine model via a feed rate value and/or via a nozzle spacing value. The processor accesses the process model and the machine model in order to calculate the spatially and time-resolved, combined setpoint data set with coordinated setpoints.Type: GrantFiled: September 17, 2024Date of Patent: April 29, 2025Assignee: BYSTRONIC LASER AGInventors: Markus Steinlin, Titus Haas
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Patent number: 12275085Abstract: A control unit for providing control instructions for controlling a laser cutting machine by determining transition phases for transforming different dynamic laser beam shapes for the laser cutting machine, for dynamically varying the shape of the laser beam is disclosed. The control unit includes a cutting plan interface for receiving a cutting plan for cutting out parts of a workpiece that are each defined by a cutting segments ordered in a queue, an allocation tool configured to allocate a specific dynamic laser beam shape to each cutting segment, a transition tool for determining transition phases between each two consecutive specific dynamic laser beam shape, and a processor configured for determining a specific dynamic laser beam shape for each cutting segment and for determining all transition phases between each two consecutive specific dynamic laser beam shapes and for providing controlling the laser cutting machine for executing the received cutting plan.Type: GrantFiled: October 24, 2022Date of Patent: April 15, 2025Assignee: BYSTRONIC LASER AGInventors: Michael Berger, Titus Haas, Simon Scheidiger
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Publication number: 20250114872Abstract: The disclosure concerns a laser processing machine for processing elongate workpieces, for example tubes. The machine comprises a fixture for fixing an elongate workpiece relative to a machine part. The fixture has a pair of first clamping members and a pair of second clamping members. The first clamping members and the second clamping members each have a clamping face. The clamping members of each pair are movable in mutually opposite clamping directions towards each other to clamp the workpiece between their clamping faces.Type: ApplicationFiled: February 9, 2023Publication date: April 10, 2025Applicant: BYSTRONIC LASER AGInventors: Luca FONTANA, Hisham SKAYKY, Davide TARONI
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Patent number: 12269122Abstract: In one aspect, the present invention relates to a control unit (RE) for calculating a spatially and time-resolved, combined setpoint data set (SW-DS) for open- and/or closed-loop control of a laser cutting process during laser cutting with a laser cutting machine (L), wherein a processor (P) is intended to access a process model (PM) in a first memory (SI) via a process interface (P-SS) and a machine model (MM) in a second memory (S2) via a machine interface (M-SS) in order, on the basis of an estimated status data of the laser cutting process and the movement process, to calculate the spatially and time-resolved, combined setpoint data set (SW-DS) with coordinated setpoints for the laser cutting process and setpoints for the movement process, taking into account the read-in sensor data.Type: GrantFiled: October 15, 2021Date of Patent: April 8, 2025Assignee: BYSTRONIC LASER AGInventors: Markus Steinlin, Titus Haas
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Patent number: 12269114Abstract: A control unit for determining a dynamic laser beam shape for controlling a laser cutting machine, which is provided with a dynamic beam shaping module for varying the shape of the laser beam. The control unit includes a cutting plan interface, which is configured for receiving a cutting plan, an interface to a shape storage with a stored set of dynamic laser beam shapes, in particular more than two, and a processor which is configured for automatically calculating for each of the cutting segments an allocation to a dynamic laser beam shape of the set of dynamic laser beam shapes, wherein calculating the allocation is based on the property indicator of the workpiece and is specific for the respective cutting segment. The processor is further configured for providing control instructions for controlling the laser cutting machine by applying the determined dynamic laser beams shapes for each cutting segment specifically.Type: GrantFiled: October 24, 2022Date of Patent: April 8, 2025Assignee: BYSTRONIC LASER AGInventors: Michael Berger, Titus Haas, Simon Scheidiger
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Patent number: 12214403Abstract: The present disclosure is directed to a method for determining the bending angle on a bending machine, wherein the bending machine includes an upper tool and a lower tool for reshaping a workpiece by bending along a bending line. One or more measuring arrangements are positioned on the bending machine, which together include at least one illumination device and in each case at least one image acquisition device. Each measuring arrangement is assigned a different surface portion of the workpiece which lies laterally adjacent to the bending line and extends along the bending line. A light pattern is imaged on the workpiece by means of the at least one illumination device of a respective measuring arrangement onto the assigned surface portion. The light pattern contains a plurality of zones which are arranged side by side along the bending line.Type: GrantFiled: March 24, 2022Date of Patent: February 4, 2025Assignee: BYSTRONIC LASER AGInventor: Kevin Scharfenberg
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Patent number: 12214405Abstract: A bending machine includes an upper beam that is movable in the direction of a primary axis (y) of the bending machine relative to a lower beam to form a workpiece which can be inserted between the upper beam and the lower beam via a front side. A position measuring system for measuring and monitoring a respective position of the upper beam with respect to a reference position is provided. The position measuring system is configured such that a linearly movable measuring unit follows a movement of the upper beam in the direction of the primary axis (y) and moves along a stationary linear element. The linearly movable measuring unit is held on the upper beam by a connecting element that is resistant to deformation in the direction of the primary axis (y), and configured to be elastic in the width direction (z) and/or a depth direction (x).Type: GrantFiled: August 18, 2022Date of Patent: February 4, 2025Assignee: BYSTRONIC LASER AGInventor: Lars Woidasky
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Patent number: 12204831Abstract: A design unit and a computer-implemented method for calculating a design data set for designing a part-specific gripping tool for gripping parts that have to be transported from or to a processing machine is disclosed. The method includes the steps of providing part parameters for at least one part which is to be gripped with the part-specific gripping tool and executing a design algorithm which designs the part-specific gripping tool from the part parameters provided and thereby outputs a gripping tool data set as a result.Type: GrantFiled: December 14, 2020Date of Patent: January 21, 2025Assignee: BYSTRONIC LASER AGInventors: Stefan Jost, Alain Meyer, Stefan Jacobi
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Patent number: 12194563Abstract: The present disclosure relates to a machining apparatus for laser machining a workpiece, such as laser cutting. The apparatus includes a machining laser source for generating a machining laser beam; an illumination laser source having a power for generating an illumination laser beam having a spectral range; an outlet opening for the machining laser beam and the illumination laser beam; and a laser beam guiding device which is designed such that the machining laser beam and the illumination laser beam emerge coaxially through the outlet opening; wherein at least one element selected from the power of the illumination laser source and the spectral range of the illumination laser beam is selected such that the illumination by the illumination laser beam is brighter than a self-emission of the workpiece in a machining region during laser machining. Additionally, a method for laser machining a workpiece is also included in the present disclosure.Type: GrantFiled: October 25, 2019Date of Patent: January 14, 2025Assignee: BYSTRONIC LASER AGInventor: Andreas Luedi
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Patent number: 12157181Abstract: A holder for a transmissive optical element is specified, having a frame and a mount for the transmissive optical element. The mount is mounted within the frame with two adjusting elements and with a guide pin arranged between the adjusting elements and its distance from the frame can be adjusted. The adjusting elements are each mounted in the frame so that they can pivot and are adjustable in their respective lengths independently of one another. The mount-side ends of the adjusting elements can each be pivoted in the mount and are attached so that they can be displaced in the longitudinal direction of the respective adjusting element. The frame-side end of the guide pin is fixed to the frame, and the frame-side end of the guide pin is pivotably mounted in the frame in the X and Y directions and slidable in the longitudinal direction of the guide pin. A method for adjusting the position of a transmissive optical element is also specified.Type: GrantFiled: August 18, 2022Date of Patent: December 3, 2024Assignee: BYSTRONIC LASER AGInventors: Tobias Schwind, Stefan Richard, Martin Mumenthaler, Marco Tramontano
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Patent number: 12097550Abstract: A bending machine for bending workpieces is disclosed. The bending machine includes a lower beam and an upper beam for forming a workpiece by bending along a bending line. A tool holder for receiving bending tools is provided on the lower beam and each end of the tool holder is associated with a recessed region which is formed in the lower beam overlapping with the respective end. The lower beam includes a central element and at least one side element arranged adjacent to one another in the thickness direction of the lower beam. Recessed regions are provided in the central element and/or in the width direction adjacent to the central element. The lower beam also includes a central region in which, during a bending operation of a workpiece, a force is introduced via the tool holder both into the central element and into the at least one side element.Type: GrantFiled: April 14, 2022Date of Patent: September 24, 2024Assignee: BYSTRONIC LASER AGInventor: Lars Woidasky
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Publication number: 20240261838Abstract: The invention relates to a bending machine, in particular a press brake, having an upper beam and a lower beam. The upper beam is movable in a working direction of the bending machine in order to form a workpiece by bending along a bending line, which extends in a width direction of the bending machine. The bending machine includes a safety system having a first functional element and a further functional element for monitoring a safety area between both functional elements and between the upper beam and the lower beam. The safety system is arranged to follow the movement of the upper beam in the working direction. The first functional element and the further functional element are mechanically connected to one another via a flexible tractive force transmission means and an adjustment device for changing the position of the functional elements. The adjustment device includes a coupling section.Type: ApplicationFiled: May 11, 2022Publication date: August 8, 2024Applicant: BYSTRONIC LASER AGInventors: Lars WOIDASKY, Ronny WENIG
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Publication number: 20240261894Abstract: A holder for a transmissive optical element is specified, having a frame and a mount for the transmissive optical element. The mount is mounted within the frame with two adjusting elements and with a guide pin arranged between the adjusting elements and its distance from the frame can be adjusted. The adjusting elements are each mounted in the frame so that they can pivot and are adjustable in their respective lengths independently of one another. The mount-side ends of the adjusting elements can each be pivoted in the mount and are attached so that they can be displaced in the longitudinal direction of the respective adjusting element. The frame-side end of the guide pin is fixed to the frame, and the frame-side end of the guide pin is pivotably mounted in the frame in the X and Y directions and slidable in the longitudinal direction of the guide pin. A method for adjusting the position of a transmissive optical element is also specified.Type: ApplicationFiled: August 18, 2022Publication date: August 8, 2024Applicant: BYSTRONIC LASER AGInventors: Tobias SCHWIND, Stefan RICHARD, Martin MUMENTHALER, Marco TRAMONTANO
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Patent number: 12042880Abstract: Cutting a workpiece and producing workpiece parts are disclosed. The device has a cutting head with laser beam optics with a dynamic laser beam movement unit. A cutting head movement unit moves the laser beam over the workpiece. A control unit has a determination module to determine a movement trajectory of the laser beam, a memory unit from which at least one predetermined parameter selected from a movement parameter of the cutting head movement unit, a movement parameter of the laser beam movement unit and a parameter of a deviation of a cut contour from a predetermined contour is retrievable, and an optimization module for adjusting the movement trajectory by overlaying the movement of the laser beam via the cutting head with a high frequency beam-shaping movement of the laser beam via the laser beam movement unit based on the at least one predetermined parameter.Type: GrantFiled: March 9, 2022Date of Patent: July 23, 2024Assignee: BYSTRONIC LASER AGInventors: Titus Haas, Simon Scheidiger, Markus Steinlin, Michael Berger
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Patent number: 12030104Abstract: The invention relates to a workpiece stop, a signal output device for outputting a signal directly perceivable to an operator of a workpiece processing machine from his/her working position, an imaging device for generating at least one image of the interior of a workpiece processing machine, a device for monitoring a processing position of a workpiece, a work-piece processing machine, a use of a device for monitoring a processing position of a work-piece, a use of a workpiece processing machine and a method for processing a workpiece in a workpiece processing machine. These devices and method promote safe and efficient operation of a workpiece processing machine.Type: GrantFiled: September 18, 2019Date of Patent: July 9, 2024Assignee: BYSTRONIC LASER AGInventor: Lars Woidasky
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Publication number: 20240157425Abstract: The present disclosure relates to a method for determining the bending angle on a bending machine, wherein the bending machine includes an upper tool and a lower tool for reshaping a workpiece by bending along a bending line. One or more measuring arrangements are positioned on the bending machine, which together include at least one illumination device and in each case at least one image acquisition device. Each measuring arrangement is assigned a different surface portion of the workpiece which lies laterally adjacent to the bending line and extends along the bending line. A light pattern is imaged on the workpiece by means of the at least one illumination device of a respective measuring arrangement onto the assigned surface portion. The light pattern contains a plurality of zones which are arranged side by side along the bending line.Type: ApplicationFiled: March 24, 2022Publication date: May 16, 2024Applicant: Bystronic Laser AGInventor: Kevin Scharfenberg
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Patent number: 11980966Abstract: In one aspect, the present invention relates to a computing unit (RE) for executing a conversion algorithm, having an interface (UI) for acquiring a first cutting parameter data set (1SP); and having a processor (P) which is designed to extract a movement profile object (bpo) and which is also designed to execute a conversion algorithm that is stored in a memory of the electronic computing unit (RE) so that it can be loaded and/or executed to calculate and provide the second cutting parameter data set (2SP) to the acquired first cutting parameter data set (1SP), wherein the second cutting parameter data set (2SP) is calculated as a function of the extracted movement profile object (bpo).Type: GrantFiled: October 15, 2021Date of Patent: May 14, 2024Assignee: BYSTRONIC LASER AGInventors: Michael Held, Titus Peter Haas, Daniel Borer, Elio Ingold
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Patent number: 11975402Abstract: A beam machining head (10; 100; 200) for beam cutting of a workpiece is provided, having an interface (12) for an energy beam source (14; 14, 201) for generating a focused machining energy beam (15; 206) selected from a particle beam source, a fuel fluid beam source, a plasma beam source and/or a source for electromagnetic radiation; an exit opening (16) for the machining energy beam bounded by an opening edge (18); an optical detector unit (19) for recording at least one image of an electromagnetic radiation (17) emitted from the workpiece (11) through the exit opening into the beam machining head (10; 100; 200) and induced in the workpiece by the machining energy beam; and a monitoring unit (30) connected in a data-transmitting manner to the optical detector unit for monitoring a positional relationship between a centre of the emitted electromagnetic radiation and the exit opening, wherein the monitoring unit (30) has: a first determination module for determining at least one position (180; 182) of the exitType: GrantFiled: October 15, 2021Date of Patent: May 7, 2024Assignee: BYSTRONIC LASER AGInventors: Christoph Fahrni, Stefan Kaltenbach, Titus Haas, Andreas Luedi
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Publication number: 20240082901Abstract: A bending machine for bending workpieces is disclosed. The bending machine includes a lower beam and an upper beam for forming a workpiece by bending along a bending line. A tool holder for receiving bending tools is provided on the lower beam and each end of the tool holder is associated with a recessed region which is formed in the lower beam overlapping with the respective end. The lower beam includes a central element and at least one side element arranged adjacent to one another in the thickness direction of the lower beam. Recessed regions are provided in the central element and/or in the width direction adjacent to the central element. The lower beam also includes a central region in which, during a bending operation of a workpiece, a force is introduced via the tool holder both into the central element and into the at least one side element.Type: ApplicationFiled: April 14, 2022Publication date: March 14, 2024Applicant: BYSTRONIC LASER AGInventor: Lars WOIDASKY
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Patent number: 11927927Abstract: The present disclosure relates to a method of calculating process parameters. which are optimized for processing a workpiece with specific material properties by means of a laser machine, comprising the method steps of: determining material properties for which the process parameters should be optimized; determining preconfigured initial process parameters; executing a re-optimization algorithm until a target objective function is minimized or maximized for calculating optimized material-specific process parameters by accessing a storage with a statistical model, wherein the statistical model is based on Bayesian optimization using Gaussian Processes as priors.Type: GrantFiled: August 18, 2021Date of Patent: March 12, 2024Assignee: BYSTRONIC LASER AGInventors: Michael Held, Dario Piga, Loris Roveda, Alessio Benavoli, Luca Maria Gambardella