Patents Assigned to C-Core Technologies, Inc.
  • Expansion constrained die stack
    Patent number: 7173325
    Abstract: Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection components. At least one of the printed wiring board assemblies includes an interposer substrate having a constraining layer that includes carbon.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: February 6, 2007
    Assignee: C-Core Technologies, Inc.
    Inventors: Kalu K. Vasoya, Bharat M. Mangrolia