Patents Assigned to C.F. Wan Incorporated
  • Patent number: 6060336
    Abstract: A micro-electro-mechanical device and method of manufacture therefore with a suspended structure formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer serving as support and spacer and the rest of the organic adhesive layer serving as a sacrificial layer, which is removed by a dry etch means. Said substrate wafer may contain integrated circuits for sensing and controlling the device.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: May 9, 2000
    Assignee: C.F. Wan Incorporated
    Inventor: Chang-Feng Wan